Integral Floor Panel Coupling for Cost-Effective Fold-Down Locking
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Solution Overview
Problem
Existing floor panel coupling systems face challenges in achieving sufficient stiffness and ease of installation while maintaining cost-effectiveness, often requiring costly elastic locking strips or compromising on connection strength and ease of assembly.
Innovation Solution
The development of floor panels with integral coupling parts featuring horizontally and vertically active interlock systems, made from the panel material itself, allowing for rotational or downward movement coupling, which includes specific contact face configurations to enhance locking zones and reduce the risk of splitting or height differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If separate elastic locking strips are used to achieve vertical interlock, then connection strength is improved, but production cost increases
Solution Approach 1:
The patent combines the vertical and horizontal interlock functions into a single integrated coupling profile that is extruded as one piece. This eliminates the need for separate elastic locking strips while maintaining both vertical connection strength and horizontal locking capability, thereby reducing production cost by removing additional components and assembly steps.
Solution Approach 2:
The coupling profile serves multiple functions simultaneously: it provides vertical interlocking through its downwardly extending portion, horizontal locking through the groove and protrusion system, and structural support. This multi-functionality replaces what would traditionally require multiple separate components, resolving the contradiction between strength and manufacturing cost.
2Ease of manufacture
If integral coupling profiles are used to reduce cost, then production cost decreases, but connection strength and ease of installation are compromised
Solution Approach 1:
The integral coupling profile is segmented into distinct functional zones: a downwardly extending portion for vertical interlock, a groove for horizontal locking, and protrusions for positioning. This segmentation allows each zone to be optimized for its specific function while maintaining overall structural integrity, ensuring adequate connection strength despite using a single integrated component.
Solution Approach 2:
The patent optimizes geometric parameters of the coupling profile including the angle of the downwardly extending portion, the depth and width of the groove, and the size of protrusions. By carefully adjusting these parameters, the design achieves sufficient connection strength and ease of installation while maintaining the cost advantages of an integral extruded profile.
3Device complexity
If coupling parts are made from the floor panel material itself, then device complexity is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The coupling profile is extruded integrally with the floor panel in a single continuous process, eliminating the need for separate manufacturing and assembly of coupling components. This merging of components simplifies the overall device structure while the extrusion process inherently ensures consistent precision across the coupling features.
Solution Approach 2:
The extrusion process parameters are optimized to achieve the required precision for the coupling profile features. By controlling extrusion temperature, pressure, and die design, the patent ensures that the integrated coupling parts meet precision requirements without requiring additional machining or assembly operations, thus reducing device complexity.
Data Source
AI summary
A floor panel for forming a floor covering consisting of floor panels which are provided with coupling parts on at least one pair of edges. The coupling parts are made mainly of the material of the floor panel, and the coupling parts are configured such that two of such floor panels can be installed and locked together at the pair of edges via a downward movement and/or via the fold-down principle.