Integral Heat Spreader Dam and Flange for IC Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current integrated circuit packaging technologies face challenges with increasing clock rates, electromagnetic interference (EMI) radiation, thermal loads, and second-level assembly reliability stresses, leading to higher production costs and potential errors in manufacturing, especially in portable electronics where space and power efficiency are critical.
Innovation Solution
The integration of a heat spreader with a single integral structure featuring a dam and a flange, where the dam height is greater than the flange height, allows for effective heat dissipation, electromagnetic isolation, and reduced production costs by enabling the stacking of devices and eliminating the need for dedicated mold chases, while also minimizing warpage and preventing mold flash contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional separate dam and flange structures are used in heat spreader design, then manufacturing complexity increases and production costs rise, but thermal management effectiveness is maintained
Solution Approach 1:
The patent combines the dam and flange structures into a single integral heat spreader component. The dam portion extends from the heat spreader to form a barrier, while the flange portion provides mounting capability. This integration eliminates the need for separate dam and flange components, reducing assembly steps and manufacturing complexity while maintaining the thermal management and structural functions.
2Reliability
If dam height is increased to prevent mold flash contamination, then packaging reliability improves, but manufacturing complexity and potential warpage increase
Solution Approach 1:
The dam structure is integrated into the heat spreader as an integral portion rather than a separate component. This allows the dam to provide effective mold flash prevention while being manufactured as a single piece with the heat spreader, reducing overall structural complexity and eliminating assembly requirements for the dam component.
3Productivity
If multiple separate components are used for heat spreader, dam, and flange, then functional requirements are met, but production time and costs increase
Solution Approach 1:
The heat spreader, dam, and flange are consolidated into a single integral structure. This eliminates the need for separate manufacturing and assembly of these components, reducing production time and costs while maintaining all necessary functions including heat dissipation, mold flash prevention, and mounting capability.
Solution Approach 2:
The integral heat spreader structure performs multiple functions simultaneously: the heat spreader portion dissipates thermal energy, the dam portion prevents mold flash contamination, and the flange portion provides mounting capability. This multi-functionality in a single component reduces assembly complexity and improves production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance, improves board-level reliability, and reduces production costs by allowing for more efficient heat dissipation and assembly processes, while maintaining structural integrity and reducing the risk of errors in manufacturing.
Implementation Method 1
heat spreader having an opening formed by a single integral structure with a dam and a flange
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a single integral structure with a dam and a flange, the dam having a dam height greater than a flange height of the flange; and forming a package encapsulation over the device mounting structure and the bottom substrate with the device mounting structure exposed within the opening.