Integrally Formed Inductor Structure for Stable Low-Resistance Electrodes
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Solution Overview
Problem
Existing integrally-formed inductors face challenges in mechanical strength between electrodes and bare metal wire, and in reducing the thickness of the inductive component, due to issues with electrode formation and contact resistance.
Innovation Solution
The integration of a metal structure with a bare conductor wire and electrodes, where the electrodes are thicker than the wire, forming a contiguous metal path, and encapsulated within a magnetic body, enhancing mechanical strength and reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are formed by electroplating process on magnetic body surfaces, then electrical connection is achieved, but contact resistance becomes unstable and yield rate decreases
Solution Approach 1:
The patent merges the electrode and conductor wire into a single integrally-formed metal structure. The electrodes are directly formed as extensions of the conductor wire through a single stamping process, eliminating the separate electroplating step. This integration ensures stable electrical connection and consistent contact resistance, resolving the reliability issue while improving yield rate by removing a complex manufacturing step.
2Volume of moving object
If straight-line-type coil with 60-70 μm line width is used, then inductor size is reduced, but fixing the coil during thermal-compression becomes extremely difficult
Solution Approach 1:
The patent combines the coil and electrodes into a single integrally-formed metal structure. The conductor wire with its insulation layer is stamped together with the electrodes in one piece, eliminating the need to separately fix the thin coil during thermal-compression. This integration maintains the small size benefit while dramatically improving manufacturability.
3Strength
If electrode thickness is increased to improve mechanical strength, then joint point between coil and electrode becomes more prone to rupture from bending
Solution Approach 1:
The patent integrates the electrode and conductor wire into a single monolithic metal structure formed by stamping. The electrode is not a separate component attached to the wire, but rather a continuous extension of the same metal piece. This eliminates the joint point entirely, so increasing electrode thickness for mechanical strength does not create rupture risks at connection points.
4Length of stationary object
If integrally-formed structure is adopted to reduce thickness, then manufacturing complexity increases due to electrode formation challenges
Solution Approach 1:
The patent replaces the complex electroplating process with a simple stamping operation. Instead of using electrical fields and chemical deposition to form electrodes, the invention uses mechanical stamping to directly form the metal structure with integrated electrodes in one step. This substitution dramatically reduces manufacturing complexity while achieving the thin-profile integrally-formed inductor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces contact resistance, increases mechanical strength, allows for thinner inductors, and facilitates mass production, enabling embedding in circuit boards with controlled thickness between 50 μm and 500 μm.
Implementation Method 1
a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode
Data Source
AI summary
An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.