Integral Lens Light Module for Slim Backlight Assembly
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Solution Overview
Problem
Existing light-emitting modules have complex structures due to separately formed lenses and driving circuit units, which complicate assembly and hinder miniaturization efforts, especially in achieving a slim profile for applications like LCD devices and portable terminals.
Innovation Solution
A light-emitting module with an integral module lens and driving circuit unit formed on a printed circuit board, allowing for simplified coupling and improved light mixing, and a heatsink plate for thermal management, enabling a slim profile and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a separately processed lens is individually formed on each light-emitting device, then light direction control is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
The patent merges multiple separately processed lenses into a single integral lens formed directly on the light-emitting device substrate. This integration eliminates the need for individual lens assembly, reducing structural complexity while maintaining light direction control functionality. The integral lens is formed using the same semiconductor fabrication process as the light-emitting devices, enabling precise optical control without additional assembly steps.
2Adaptability or versatility
If the driving circuit unit is formed separately from the PCB, then circuit design flexibility is improved, but assembly complexity and wiring requirements increase
Solution Approach 1:
The patent combines the driving circuit unit with the PCB by forming the driving circuit unit directly on the PCB substrate using semiconductor fabrication processes. This integration eliminates the need for separate driving circuit modules and complex wiring connections, while maintaining circuit design flexibility through direct patterning of conductive paths and components on the PCB.
3Reliability
If traditional light-emitting module structures are used, then basic functionality is achieved, but miniaturization and slim profile are hindered
Solution Approach 1:
The patent implements a nested structure where the integral lens is formed within the light-emitting device substrate, and the driving circuit unit is integrated within the PCB substrate. This nesting approach eliminates the need for separate housing and mounting structures, enabling miniaturization while maintaining all basic functionalities including light emission, optical control, and electrical driving.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a simplified assembly process, enhanced light-emitting efficiency, and a slim profile for the light-emitting module and backlight unit, facilitating their use in various applications, including LCD devices and portable terminals.
Implementation Method 1
at least one module lens supported by the printed circuit board and reflecting light emitted from the plurality of light-emitting devices
Data Source
AI summary
A light-emitting module is provided. The light-emitting module comprises a printed circuit board, a plurality of light-emitting devices, and at least one module lens. The plurality of light-emitting devices are formed on the printed circuit board. At least one module lens is supported by the printed circuit board and reflects light emitted from the plurality of light-emitting devices.