Integral Water-Cooling Radiator Structure for Heat Dissipation
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Solution Overview
Problem
Conventional water-cooling radiators suffer from poor heat transfer efficiency due to thermal resistance between independent serpentine radiating fins and flat pipes, and have structural weaknesses, along with complex and labor-intensive assembly processes.
Innovation Solution
A water-cooling radiator structure featuring stacked radiator elements with integrated sealing elements and flow passages, allowing direct heat transfer from the working fluid to fins and improved structural strength through a more integral design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If serpentine radiating fins are soldered to flat pipes at outer sides of turning points, then the radiator can be assembled from independent parts, but thermal resistance occurs and heat transfer efficiency is lowered
Solution Approach 1:
The patent merges the radiating fins and flat pipes into a single integral structure where the fins are directly formed on the pipes, eliminating the soldering connection. This integration removes the thermal resistance interface while maintaining manufacturability through processes like extrusion or molding that can create the integrated fin-pipe structure in one piece.
2Ease of manufacture
If radiating fins are soldered at outer sides of turning points, then assembly is simplified, but the middle section becomes structurally weak and prone to damage
Solution Approach 1:
By integrating the fins directly onto the flat pipes as a unified structure, the patent eliminates the weak middle section that exists in soldered constructions. The fins become an integral part of the pipe structure, distributing mechanical strength throughout the entire fin-pipe assembly rather than creating vulnerable points at the connection interfaces.
3Ease of manufacture
If conventional soldering method is used to connect fins to pipes, then manufacturing process is simple, but heat transfer efficiency is poor
Solution Approach 1:
The patent eliminates the soldering process entirely by forming the fins as an integral part of the flat pipes through extrusion or molding. This single-step manufacturing process simultaneously achieves both simplicity and high heat transfer efficiency by removing the thermal resistance interface that soldering creates, allowing direct thermal conduction from the pipe through the fins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat transfer efficiency and cooling performance while simplifying assembly and increasing structural integrity, leading to improved heat dissipation and reduced labor costs.
Implementation Method 1
heat carried by the working fluid is transferred to the radiating fins 41, from where the heat is radiated into ambient environment
Implementation Method 2
heat carried by the working fluid flowing through the flat pipes 42 is transferred to the radiating fins 41, from where the heat is radiated into ambient environment
Implementation Method 3
heat is radiated into ambient environment
Data Source
AI summary
A water-cooling radiator structure includes at least one first and at least one second sealing element and a first water-cooling radiator main body formed by a plurality of stacked first radiator elements. The second sealing element, the first radiator elements and the first sealing element are sequentially stacked and then integrally connected together through heat treating. The first and the second sealing element have one side connected to an upper and a lower side, respectively, of the first water-cooling radiator main body to seal a top and a bottom, respectively, of at least one first flow passage defined on the first water-cooling radiator main body. At least one first and second coupling section are optionally provided on the first sealing element or at two opposite ends of the first flow passage; and the first and the second coupling section are fluidly communicable with the first flow passage.