Integral RF Shield Fabrication for Electronics Packages
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Solution Overview
Problem
Conventional metal shields for electronics packages are costly to fabricate and customize, and they increase the size of the components, making them undesirable for reducing electromagnetic interference.
Innovation Solution
A method and system for fabricating an electromagnetic shield by exposing ground contact features, depositing metal shielding material to cover the surfaces and fill trenches, and electrically connecting it to the ground contact features, which can be applied to various substrate-based electronics packages, including Molded Array Packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal shields are used to protect electronic components from RF radiation, then electromagnetic interference is reduced, but fabrication cost increases and component size increases
Solution Approach 1:
The patent combines the shield formation process with the existing mold compound application process. The mold compound is applied over the entire package including the shield region, and then selectively removed only where needed. This integrates two functions (protection and shielding) into a single process flow, eliminating the need for separate custom metal shield fabrication and assembly operations.
Solution Approach 2:
The patent uses the existing mold compound pattern as a template or copy for the shield formation. By applying mold compound over the entire package and then selectively removing portions, the shield geometry is defined by the negative space of the mold compound pattern, replicating the protective function without requiring custom metal shield design and fabrication.
2Object-affected harmful factors
If conventional metal shields are used to protect electronic components from RF radiation, then electromagnetic interference is reduced, but component size increases
Solution Approach 1:
The patent merges the shield structure with the existing package footprint by applying mold compound over the entire package area and selectively removing portions. This allows the shield to be formed within the existing package boundaries rather than adding external metal shields that would increase overall component volume.
Solution Approach 2:
The patent uses a thin layer of mold compound as a flexible masking material that can be applied conformally over the entire package surface. This thin film approach provides the necessary shielding function without the bulk of traditional metal shields, maintaining compact component dimensions.
3Object-affected harmful factors
If conventional metal shields are used to protect electronic components from RF radiation, then electromagnetic interference is reduced, but assembly complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated process: the mold compound application serves both as protective coating and as the basis for shield formation. The selective removal step creates the shield geometry directly from the applied compound, eliminating separate metal shield fabrication, handling, and assembly operations.
Solution Approach 2:
The mold compound application process serves its primary protective function while simultaneously creating the precursor structure for the shield. The process is self-sufficient, requiring no additional custom assembly equipment or separate shield installation steps, as the shield is formed directly during the normal packaging process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides an integral RF shield that is lower in cost and does not significantly increase the size of the electronics package, effectively reducing electromagnetic interference while being simpler and more cost-effective to implement.
Implementation Method 1
depositing a metal shielding material that substantially covers the top surfaces and side surfaces of the electronics package, filling the trenches
Data Source
AI summary
A method and system for fabricating an electromagnetic radiation shield for an electronics package is disclosed. The electronics package includes a substrate, at least one ground contact feature, and a protective layer. The electronics package is physically coupled to at least one additional electronics package through at least the substrate. The method and system include exposing a portion of the ground contact feature(s) by removing a portion of the electronics package above the ground contact feature(s). The exposing step forms at least one trench above the ground contact feature(s). The method and system also include depositing an electromagnetic radiation shield that substantially covers the electronics package, fills the trench(es), and is electrically connected to the ground contact feature(s). The method and system also include separating the electronics package from the additional electronics package(s) such that a remaining portion of the electromagnetic radiation shield that substantially encloses a portion of the electronics package above the ground contact feature(s) remains.