Integral Water Cooling Heat Dissipation Structure

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Solution Overview

Problem

Conventional water cooling devices suffer from inefficient heat dissipation due to thermal resistance between independent heat radiation fins and flat pipes, and have weak structural integrity, leading to assembly complexities and potential damage.

Innovation Solution

A water cooling heat dissipation structure comprising stacked heat dissipation members with grooves and turbulent areas forming flow passages, secured by connecting portions and plates, enhancing heat transfer and structural strength through vortex flow and integrally formed metal laminations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If heat radiation fins and flat pipes are connected by welding at several points, then assembly is simplified, but thermal resistance increases and heat transfer efficiency deteriorates

Engineering Contradiction:
Improveassembly simplicityVSAvoidheat transfer efficiency
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent integrates the heat radiation fins and flat pipes into a single integrally formed piece, eliminating the welding connection and thermal resistance interface. This merging of previously separate components directly resolves the contradiction by achieving both good thermal contact (improved heat transfer efficiency) and simplified assembly (no welding required).

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent employs a composite structure where the integrally formed piece combines heat radiation fins and flat pipes as unified thermal conduction pathways. This composite design ensures continuous thermal flow from the heat generating element through both components simultaneously, improving heat transfer efficiency while maintaining manufacturing simplicity.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If heat radiation fins are connected only at several points to flat pipes, then structural complexity is reduced, but central portion becomes weak and prone to damage

Engineering Contradiction:
Improvestructural complexityVSAvoidstructural strength
Core Design Contradiction:
Device complexityVSStrength

Solution Approach 1:

By merging the heat radiation fins and flat pipes into one integrally formed piece, the patent eliminates the weak connected joints and creates a continuous, uniform structure. This integral formation distributes mechanical stress evenly throughout the component, significantly improving structural strength while maintaining simple geometry suitable for injection molding.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If conventional water cooling device uses multiple independent members, then manufacturing flexibility is improved, but assembly time increases and water leaking risks increase

Engineering Contradiction:
Improvemanufacturing flexibilityVSAvoidassembly time
Core Design Contradiction:
Ease of manufactureVSLoss of time

Solution Approach 1:

The patent combines multiple independent members (flat pipes, heat radiation fins, connecting portions) into a single integrally formed piece that can be manufactured in one injection molding process. This eliminates the need for separate assembly steps and welding operations, dramatically reducing assembly time while maintaining manufacturing flexibility through modular design of the integral component.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

While integrating components, the patent maintains functional segmentation through the molded structure - the heat radiation fins, flat pipes, and connecting portions are distinct functional zones within the single piece. This segmentation allows optimized design of each functional area while achieving unified manufacturing, reducing assembly steps without sacrificing manufacturing flexibility.

Inventive Principle:
Principle #1Segmentation

4Adaptability or versatility

If heat radiation fins are made flexible, then adaptability is improved, but central portion weakness increases and heat transfer effect deteriorates

Engineering Contradiction:
ImproveadaptabilityVSAvoidheat transfer effect
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The integral formation merges the structural support function and heat transfer function into a single continuous piece. The flat pipes and heat radiation fins form an unified thermal conduction pathway that maintains effective heat transfer while the overall structure retains flexibility for adaptation to different mounting surfaces, resolving the contradiction between flexibility and heat transfer effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly improves heat dissipation efficiency by facilitating effective heat transfer and structural integrity, allowing for easier assembly and enhanced durability.

Implementation Method 1

a plurality of turbulent areas (244a) provided therein. The turbulent areas of the heat dissipation members are stacked to form a plurality of turbulent sections (245a) located in the flow passage

Methodology Applied
Scientific EffectVortex flow: Vortex Ring

Implementation Method 2

Each the heat dissipation member has at least one groove (242a) extended therethrough and a plurality of turbulent areas (244a) provided therein

Methodology Applied
Scientific EffectTurbulence: Turbulence

Implementation Method 3

heat produced by the electronic elements cannot be effectively transferred from the cooling water to the heat radiation fins 11, and further a thermal resistance occurs when the heat is transferred from the flat pipes 12 to the heat radiation fins 11

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11399446B2Water cooling heat dissipation structure
Publication Date: 2022.07.26 ASIA VITAL COMPONENTS CO LTD
  • US11399446B2 patent drawing
  • US11399446B2 patent drawing
  • US11399446B2 patent drawing

AI summary

A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage.