Integrated AI Sensor Architecture for Low-Latency Signal Processing
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Solution Overview
Problem
The existing system architecture for combining artificial intelligence and sensor technology faces limitations in transmission bandwidth, high transmission delay, and signal distortion, particularly in applications sensitive to delay such as automatic driving, due to the use of data lines for signal transmission.
Innovation Solution
The integration of sensor modules and artificial intelligence processing modules in a monolithic or modular manner, utilizing metal wires or connecting plates for direct connection, reduces transmission distance and improves data transmission rates and reduces delay.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If sensor module and AI processing module are connected through data line, then system architecture is simple, but data transmission rate is limited and delay increases
Solution Approach 1:
The patent merges the sensor module and AI processing module into a single integrated unit, where the sensor module includes both sensing elements and AI processing circuits. This integration eliminates the need for separate data lines connecting distinct modules, thereby increasing data transmission rate while managing system complexity through functional consolidation.
2Loss of time
If data is transmitted through data line from sensor to SoC, then system architecture is modular, but transmission delay increases
Solution Approach 1:
The patent transitions from a traditional modular architecture with separate sensing and processing modules connected via data lines to an integrated architecture where sensing and AI processing functions coexist within the same module. This dimensional reorganization of system architecture reduces transmission delay by eliminating inter-module data lines, enabling the system to meet the real-time requirements of delay-sensitive applications.
3Productivity
If sensor module and AI processing module are integrated in monolithic or modular manner, then data transmission rate increases and delay reduces, but manufacturing complexity increases
Solution Approach 1:
The patent offers two integration approaches: monolithic integration where all functions are combined in a single chip, and modular integration where the sensor module and AI processing module are separate but tightly coupled. The modular approach segments the system into manageable units that can be manufactured independently and then assembled, reducing manufacturing complexity while still achieving high data processing efficiency and low latency.
Data Source
AI summary
Provided are an intelligent sensor system architecture and an implementation method and apparatus therefor. The system architecture includes a sensor module and an artificial intelligence processing module, where the sensor module and the artificial intelligence processing module are connected to each other in a monolithic integration manner or a modular integration manner; the sensor module is configured to acquire a measurement signal and convert the measurement signal into an electrical signal; and the artificial intelligence processing module is configured to execute a corresponding artificial intelligence processing operation according to the electrical signal generated by the sensor module.