Integrated Solid-State Amplifier and Antenna PCB for RF Heating
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Solution Overview
Problem
Existing microwave and radio frequency heating devices are complex in terms of assembly and manufacture, leading to increased costs and installation space requirements, and lack efficiency in generating and applying high-frequency radiation for cooking and heating applications.
Innovation Solution
A radiation device with a solid-state power amplifier module and antenna integrated on a single printed circuit board, allowing for simplified assembly and manufacture, efficient signal transmission, and flexible frequency operation in the RF and MW range, with a compact design that eliminates the need for connectors and cables, and a housing that shields electronic components while allowing high-frequency radiation to pass through.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate amplifier and antenna components are used with connectors and cables, then assembly and manufacture become complex, but integration on a single PCB simplifies the process
Solution Approach 1:
The patent combines the amplifier module and antenna into a single integrated unit on one PCB, eliminating the need for separate components, connectors, and cables. This merging approach directly reduces assembly complexity and manufacturing steps while maintaining functional performance.
Solution Approach 2:
The PCB serves multiple functions simultaneously: it acts as the circuit board for the amplifier, the mounting structure for the antenna, and the transmission medium for RF signals. This multi-functionality reduces the overall component count and simplifies the device architecture.
2Loss of energy
If connectors and cables are used for signal transmission, then assembly is simplified, but transmission losses increase
Solution Approach 1:
The patent removes connectors and cables from the signal transmission path, extracting these components entirely from the system. The RF signal is transmitted directly through the PCB trace from the amplifier to the antenna, eliminating the source of transmission losses associated with traditional connectors and cables.
3Volume of moving object
If a compact integrated design is used, then installation space is reduced, but shielding requirements increase
Solution Approach 1:
By merging the amplifier and antenna into a compact integrated unit on a single PCB, the patent significantly reduces the installation space required. The close integration allows for effective shielding design where the PCB structure itself and minimal additional shielding materials can contain electromagnetic interference, rather than requiring separate enclosures for each component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing and assembly process, reduces transmission losses, and enhances the efficiency and flexibility of high-frequency radiation application for heating and cooking, offering a cost-effective and space-efficient solution for various heating scenarios.
Implementation Method 1
a solid state power amplifier module with at least one input port and at least one output port, the solid state power amplifier module configured for amplifying signals received at the input port, in particular from a signal generator module, and for outputting the amplified signals at the output port
Implementation Method 2
at least one antenna coupled to the output port of the solid state power amplifier module, the at least one antenna configured for emitting high frequency radiation based on the signals from the output port of the solid state power amplifier module
Implementation Method 3
configured for dielectrically heating, in particular cooking, one or more objects, such as food objects, food items, or foodstuff, with high frequency radiation
Implementation Method 4
a housing configured for shielding the electronic components from the high frequency radiation generated and emitted by the at least one antenna
Data Source
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AI summary
The underlying invention is in particular directed to a radiation device (8) configured for dielectrically heating, in particular cooking, of one or more objects (37), such as foodstuff, with high frequency radiation (9) in the radio frequency range, and/or microwave frequency range in a cavity (7) of a heating appliance (35), in particular a cooking appliance (35), comprising: - at least one solid state power amplifier module (4) with at least one input port (11) and at least one output port (12), the solid state amplifier module (4) configured for amplifying radio frequency and/or microwave frequency signals received at the input port (11), and for outputting the amplified radio frequency and/or microwave signals at the output port (12); and - at least one antenna (6) coupled to the output port (12) of the solid state amplifier module (4) and at least configured for radiating radio frequency or microwave frequency radiation (9) based on the signals from the output port (12) of the solid state amplifier module (4), the at least one solid state power amplifier module (4) and the at least one antenna (6) being integrated on a common printed circuit board layout (13).