Integrated Antenna Structure in Electronic Device Module
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Solution Overview
Problem
Current technologies face challenges in integrating multiple electronic device components, such as RF circuits and antennas, into a single module due to differing fabrication processes and complexities in assembly, leading to increased costs and complexity.
Innovation Solution
An electronic device module is fabricated by attaching an electronic device package and a conductive ground element to a temporary carrier substrate, encapsulating them, and forming an antenna circuit structure with a patch antenna signal element and ground element, which cooperates to form an integrated antenna, allowing for efficient embedding and interconnection of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic device components (RF circuits and antennas) are integrated into a single module, then functionality density is improved, but device complexity increases due to differing fabrication processes and assembly complexities
Solution Approach 1:
The patent combines the antenna structure and RF circuit into a single integrated module, where the ground plane serves dual purposes as both an electrical ground reference and an antenna radiating element. This merging eliminates the need for separate antenna components and reduces assembly complexity while maintaining functionality density.
Solution Approach 2:
The ground plane is designed to perform multiple functions simultaneously: it provides electrical grounding for the RF circuit, acts as a radiating element for the antenna, and serves as a structural support element. This multi-functionality reduces the total number of components needed in the integrated module.
2Adaptability or versatility
If multiple electronic device components are integrated into a single module, then functionality density is improved, but manufacturing cost increases due to complicated assembly processes
Solution Approach 1:
By merging the antenna and RF circuit into a single integrated package with a unified fabrication process, the patent eliminates multiple assembly steps and reduces manufacturing costs. The ground plane structure is formed using the same semiconductor fabrication processes as the RF circuit, avoiding costly post-assembly operations.
3Device complexity
If an integrated antenna structure is formed within the ground plane, then device complexity is reduced, but antenna performance may be compromised due to integration constraints
Solution Approach 1:
The patent applies local quality by creating specific regions within the ground plane with different electrical characteristics. The ground plane includes designated radiating sections with optimized geometries for antenna operation, while other regions maintain standard ground plane properties for electrical grounding, thus maintaining antenna performance within the integrated structure.
Solution Approach 2:
The antenna structure is implemented in the planar dimension of the ground plane rather than requiring vertical stacking or three-dimensional arrangements. This allows the antenna to be formed using standard two-dimensional semiconductor fabrication techniques while maintaining effective radiating area and performance.
Data Source
AI summary
An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module.