Integrated Antenna Package with EBG Structures for 77 GHz Radar
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Solution Overview
Problem
Current packaging solutions for radio frequency integrated circuit die suffer from signal insertion losses and electromagnetic interference, particularly in millimeter-wave applications, which complicates the design of compact electronic systems.
Innovation Solution
An integrated antenna package is developed using an interposer with a coplanar waveguide for RF signal transmission, a cap with metamaterials for efficient operation at millimeter-wave frequencies, and a slot resonator to excite a patch antenna, along with separate transmit and receive sections for radar applications, minimizing direct encapsulation of the die and employing lossy and lossless electromagnetic band-gap structures to suppress unwanted RF modes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If integrated circuit die are packaged at radio frequencies measured in millimeters, then signal transmission is achieved, but signal insertion losses and electro-magnetic interference occur
Solution Approach 1:
The package is divided into separate transmit and receive sections with physical isolation, and the signal path is segmented into distinct functional areas (antenna, transmission line, integrated circuit) to minimize interference between components
Solution Approach 2:
Electromagnetic band-gap structures are selectively placed at specific locations within the package - particularly at the integrated circuit leads and signal transmission paths - to provide localized suppression of unwanted electromagnetic modes without affecting the entire package uniformly
2Volume of moving object
If the size of electronic systems is reduced, then compactness is improved, but system complexity increases for a given performance
Solution Approach 1:
The antenna, transmission line, and integrated circuit are merged into a single integrated package structure, reducing the overall system volume while maintaining functional performance through careful design of the electromagnetic band-gap structures that enable compact signal routing
3Object-generated harmful factors
If electromagnetic band-gap structures are used to suppress unwanted RF modes, then package isolation is improved, but manufacturing complexity increases
Solution Approach 1:
The electromagnetic band-gap structures are implemented using composite constructions combining conductive materials (for the band-gap patterns) with dielectric materials (for the substrate and insulation), enabling effective electromagnetic suppression while using standard manufacturing techniques for layered structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces signal insertion losses and improves package isolation, enabling efficient operation at 77 GHz frequencies while maintaining low costs, suitable for collision avoidance radar applications.
Implementation Method 1
A radio frequency (RF) signal transmission structure, such as coplanar waveguide (CPW), is integrated at the interposer to communicate an RF signal between the die and a microstrip feedline
Implementation Method 2
employing lossy and lossless electromagnetic band-gap structures to suppress unwanted RF modes
Implementation Method 3
a slot resonator to excite a patch antenna
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
An integrated antenna package (100) includes an interposer (110), an integrated circuit die (120), and a cap (130) that forms a cavity within the integrated antenna package (100). A lossy EBG structure (131) resides at the cap overlying the integrated circuit device. A lossless EBG structure (132) resides at the cap overlying a microstrip feedline (113). A radar module (1100) includes a plurality of receive portions (1111-1114), each receive portion including a parabolic structure (1420) having a reflective surface (1633), an absorber structure (1675), a lens (1653), and an antenna (1313).