Integrated Antenna Package with EBG Structures for 77 GHz Radar

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Solution Overview

Problem

Current packaging solutions for radio frequency integrated circuit die suffer from signal insertion losses and electromagnetic interference, particularly in millimeter-wave applications, which complicates the design of compact electronic systems.

Innovation Solution

An integrated antenna package is developed using an interposer with a coplanar waveguide for RF signal transmission, a cap with metamaterials for efficient operation at millimeter-wave frequencies, and a slot resonator to excite a patch antenna, along with separate transmit and receive sections for radar applications, minimizing direct encapsulation of the die and employing lossy and lossless electromagnetic band-gap structures to suppress unwanted RF modes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If integrated circuit die are packaged at radio frequencies measured in millimeters, then signal transmission is achieved, but signal insertion losses and electro-magnetic interference occur

Engineering Contradiction:
Improvesignal transmission qualityVSAvoidsignal insertion losses and electro-magnetic interference
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The package is divided into separate transmit and receive sections with physical isolation, and the signal path is segmented into distinct functional areas (antenna, transmission line, integrated circuit) to minimize interference between components

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Electromagnetic band-gap structures are selectively placed at specific locations within the package - particularly at the integrated circuit leads and signal transmission paths - to provide localized suppression of unwanted electromagnetic modes without affecting the entire package uniformly

Inventive Principle:
Principle #3Local quality

2Volume of moving object

If the size of electronic systems is reduced, then compactness is improved, but system complexity increases for a given performance

Engineering Contradiction:
Improvepackage sizeVSAvoidsystem complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The antenna, transmission line, and integrated circuit are merged into a single integrated package structure, reducing the overall system volume while maintaining functional performance through careful design of the electromagnetic band-gap structures that enable compact signal routing

Inventive Principle:
Principle #5Merging (Combining)

3Object-generated harmful factors

If electromagnetic band-gap structures are used to suppress unwanted RF modes, then package isolation is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvepackage isolationVSAvoidmanufacturing complexity
Core Design Contradiction:
Object-generated harmful factorsVSEase of manufacture

Solution Approach 1:

The electromagnetic band-gap structures are implemented using composite constructions combining conductive materials (for the band-gap patterns) with dielectric materials (for the substrate and insulation), enabling effective electromagnetic suppression while using standard manufacturing techniques for layered structures

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces signal insertion losses and improves package isolation, enabling efficient operation at 77 GHz frequencies while maintaining low costs, suitable for collision avoidance radar applications.

Implementation Method 1

A radio frequency (RF) signal transmission structure, such as coplanar waveguide (CPW), is integrated at the interposer to communicate an RF signal between the die and a microstrip feedline

Methodology Applied
Scientific EffectElectromagnetic wave propagation: Electromagnetic Induction

Implementation Method 2

employing lossy and lossless electromagnetic band-gap structures to suppress unwanted RF modes

Methodology Applied
Scientific EffectElectromagnetic energy absorption: Absorption (EM radiation)

Implementation Method 3

a slot resonator to excite a patch antenna

Methodology Applied
Scientific EffectElectromagnetic resonance: Resonance

Data Source

PatentEP2453723B1Integrated antenna package
Publication Date: 2020.03.18 NXP USA INC
  • EP2453723B1 patent drawingFigure 1
  • EP2453723B1 patent drawingFigure 2~3
  • EP2453723B1 patent drawingFigure 4

AI summary

An integrated antenna package (100) includes an interposer (110), an integrated circuit die (120), and a cap (130) that forms a cavity within the integrated antenna package (100). A lossy EBG structure (131) resides at the cap overlying the integrated circuit device. A lossless EBG structure (132) resides at the cap overlying a microstrip feedline (113). A radar module (1100) includes a plurality of receive portions (1111-1114), each receive portion including a parabolic structure (1420) having a reflective surface (1633), an absorber structure (1675), a lens (1653), and an antenna (1313).