Integrated Antenna Package Structure Without Vias or Wire Bonds
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Solution Overview
Problem
Conventional Antenna-in-Package (AiP) technology is complex, leading to high costs and low reliability due to issues like current leakage and stray capacitance in dielectric materials.
Innovation Solution
An integrated package with a molded substrate embedding a semiconductor chip and an antenna package, featuring a bottom antenna structure electrically connected to the chip and a top antenna structure for electromagnetic coupling, eliminating wire connections and through vias to prevent current leakage, and simplifying the structure for cost-effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional AiP technology uses dielectric materials and through vias for antenna integration, then antenna functionality is achieved, but current leakage and stray capacitance occur leading to low reliability
Solution Approach 1:
The patent extracts and removes the problematic dielectric materials and through vias from the antenna structure. The antenna is implemented using only conductive traces on the substrate surface, eliminating the need for embedded dielectric layers and vias that cause current leakage and stray capacitance, thereby improving reliability without requiring complex multi-layer dielectric structures
Solution Approach 2:
Instead of embedding the antenna within dielectric layers using conventional AiP methods, the patent inverts the approach by placing the antenna traces on the outer surface of the substrate. This surface-mounted trace configuration eliminates the harmful interactions with dielectric materials while maintaining antenna functionality, resolving the reliability issue without increasing structural complexity
2Ease of manufacture
If conventional AiP technology uses complex integration methods, then antenna functionality is achieved, but manufacturing cost increases
Solution Approach 1:
The patent employs a simplified antenna structure using standard PCB traces on a conventional substrate, replacing expensive specialized AiP fabrication processes. This approach uses readily available, low-cost materials and standard manufacturing techniques to achieve reliable antenna functionality, significantly reducing manufacturing cost while maintaining or improving reliability through the elimination of current leakage issues
3Productivity
If conventional AiP technology uses embedded antenna structures, then integration is achieved, but current leakage occurs reducing performance
Solution Approach 1:
The patent replaces the mechanical/embedded antenna structure with an electrical trace-based antenna system. By using conductive traces routed on the substrate surface instead of embedded conductive elements within dielectric layers, the design eliminates current leakage paths while maintaining signal transmission performance, achieving high productivity without complex integration requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a simpler, cost-effective integrated package with improved reliability by eliminating current leakage and stray capacitance, enhancing the transmission and reception of electromagnetic signals while maintaining structural support and environmental protection.
Implementation Method 1
a top antenna structure disposed on the antenna package substrate and configured for coupling electromagnetic energy with the bottom antenna structure
Data Source
AI summary
An integrated package and a method for making the same are provided. The integrated package includes: a molded substrate having a top substrate surface and a bottom substrate surface; a semiconductor chip embedded in the molded substrate; a bottom antenna structure disposed on the bottom substrate surface and electrically connected to the semiconductor chip; and an antenna package embedded in the molded substrate, and including: an antenna package substrate; and a top antenna structure disposed on the antenna package substrate and configured for coupling electromagnetic energy with the bottom antenna structure.