Integrated Antenna Package Structure for Miniaturization
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Solution Overview
Problem
The existing electronic component packaging designs, particularly in mobile communication devices, face challenges in reducing volume due to the separation of antennas from chip package structures, which necessitates additional circuitry for electrical connection, complicating miniaturization.
Innovation Solution
An integrated antenna package structure is developed, comprising a chip, circuit layer, encapsulant, conductive connector, insulating layer, dielectric substrate, and antenna, where the circuit layer is connected to the chip, and the antenna is connected to the circuit layer through the conductive connector, with the dielectric substrate and insulating layer providing structural support and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the antenna is separated from the chip package structure and connected via circuit board circuitry, then the electrical connection is established, but the volume of the entire electronic component increases
Solution Approach 1:
The patent merges the antenna with the chip package structure by integrating it into the encapsulant body. The antenna is formed as an internal structure within the encapsulant material itself, eliminating the need for separate antenna components and external circuit board connections. This integration directly reduces the overall volume of the electronic component while maintaining reliable electrical connections through conductive pathways embedded within the package structure.
Solution Approach 2:
The patent transitions the antenna from a traditional planar circuit board layout to a three-dimensional structure embedded within the encapsulant. By forming the antenna as internal traces or conductive elements within the volumetric encapsulant material, the design utilizes the third dimension (depth) for signal routing, thereby reducing the footprint and overall volume required for the electronic component.
2Volume of stationary object
If the antenna is integrated within the package structure, then the volume is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the antenna structure and its conductive pathways during the encapsulant molding process itself. The antenna traces are created as integral parts of the encapsulant before final assembly, eliminating subsequent antenna installation steps. This preliminary integration of antenna formation into the molding process reduces overall manufacturing complexity despite the integrated design.
Solution Approach 2:
The encapsulant material serves multiple functions simultaneously: it provides mechanical protection for the chip, acts as the structural body of the package, and contains the integrated antenna circuitry. This multi-functionality consolidates what would traditionally require separate components and assembly steps into a single manufacturing process, thereby reducing manufacturing complexity.
Data Source
AI summary
An integrated antenna package structure including a chip, a circuit layer, an encapsulant, a coupling end, an insulating layer, a conductive connector, a dielectric substrate, and an antenna is provided. The circuit layer is electrically connected to the chip. The encapsulant is disposed on the circuit layer and covers the chip. The coupling end is disposed on the encapsulant. The insulating layer covers the coupling end. The insulating layer is not externally exposed. The conductive connector penetrates the encapsulant. The coupling end is electrically connected to the circuit layer by the conductive connection. The dielectric substrate is disposed on the encapsulant and covers the coupling end. The antenna is disposed on the dielectric substrate. A manufacturing method of an integrated antenna package structure is also provided.