Integrated Antenna Patch Layout for Slim Electronic Devices
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Solution Overview
Problem
Next-generation wireless communication technologies face challenges in efficiently arranging antenna modules within slim electronic devices without deteriorating radiation performance due to interference from other electronic components.
Innovation Solution
An antenna arrangement structure is developed that integrates antenna elements with other electronic components, such as key button devices, without compromising radiation performance, allowing for a more efficient use of internal space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a separate antenna module is provided in the terminal, then antenna functionality is achieved, but the internal space is occupied and integration is reduced
Solution Approach 1:
The patent combines the antenna function with the speaker assembly by integrating the antenna into the speaker frame structure. The antenna and speaker share the same spatial location and structural components, eliminating the need for a separate antenna module and thereby saving internal space while maintaining both functionalities.
Solution Approach 2:
The speaker frame structure serves multiple functions: it provides mechanical support for the speaker diaphragm and simultaneously acts as the antenna structure for wireless communication. This multi-functional design eliminates redundant components and improves overall device integration.
2Volume of moving object
If the antenna is integrated into the speaker assembly, then space is saved and integration is improved, but the speaker's sound output may be affected
Solution Approach 1:
The speaker assembly is divided into functionally independent regions: the first region contains the antenna structure for wireless communication, while the second region contains the sound output components. This spatial segmentation allows both functions to operate independently without mutual interference, even though they share the same overall assembly space.
Solution Approach 2:
Different regions of the speaker assembly are designed with different functional qualities: the first region is optimized for antenna performance with appropriate electromagnetic properties, while the second region is optimized for acoustic performance. This localized functional differentiation ensures that each function operates at its optimal performance level.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables effective utilization of space within electronic devices by integrating antenna structures with other components, maintaining radiation performance and contributing to a slimmer device design.
Implementation Method 1
a first region in which an antenna is integrated into a speaker assembly
Data Source
Figure 1
Figure 2
Figure 3A
AI summary
An electronic device mayinclude a housing, an antenna structuredisposed in an inner space of the housing and including a substrate, at least one conductive patch disposed in the substrate, and at least one power feeder disposed at a specified position of the at least one conductive patch, an electronic component disposed to overlap at least in part with the at least one conductive patch when the substrate is viewed from above, and awireless communication circuit disposed in the inner space, electrically connected to the at least one power feeder, and configured to form a beam pattern in a first direction through the at least one conductive patch.The electronic component is electrically connected to a main board through at least one electrical connection structure disposed on the substrate. The at least one electrical connection structure may include a first conductive via disposed to pass through the at least one conductive patch and a ground layer of the substrate, and a second conductive via passing through the at least one conductive patch and electrically connected to the ground layer.