Integrated Antenna Shielding Structure for Compact RF Isolation
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Solution Overview
Problem
Integrating shielding technology in compact radio frequency modules to effectively shield components from electromagnetic radiation while allowing antennas to transmit and receive signals becomes challenging as more components are integrated together.
Innovation Solution
A multi-layer substrate with a ground plane positioned between an antenna and a radio frequency component, surrounded by conductive features such as bumps or copper pillars, forms a shielding structure that acts as a Faraday cage, providing effective isolation and allowing the antenna to transmit and receive signals without being shielded.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding structures are integrated around RF components in compact modules, then electromagnetic radiation shielding is improved, but device complexity increases
Solution Approach 1:
The patent merges the shielding structure with the antenna assembly by integrating conductive shields directly into the antenna housing or mounting structure. This combination allows the shielding function to be provided without adding separate, complex shielding components around the RF component, thus improving electromagnetic radiation shielding while minimizing increases in device complexity.
Solution Approach 2:
The shielding structure is designed to serve multiple functions: it provides electromagnetic radiation shielding for the RF component, acts as a mounting structure for the antenna, and can also serve as a ground reference or signal path. This multi-functionality reduces the need for additional components and simplifies the overall device structure while maintaining effective shielding.
2Productivity
If more components are integrated together in a radio frequency module, then productivity is improved, but shielding effectiveness deteriorates
Solution Approach 1:
The patent segments the radio frequency module into distinct functional zones: an antenna region, an RF component region, and intermediate shielding regions. By dividing the compact module into these separated zones with shielding barriers between them, the design maintains high component integration density while preventing electromagnetic interference between adjacent components, thus preserving shielding effectiveness despite increased integration.
Solution Approach 2:
The patent introduces intermediate shielding structures and ground planes as mediator elements between closely integrated components. These intermediary shields act as electromagnetic barriers that prevent direct interference between the antenna and RF components while allowing both to be tightly integrated in the same module, thereby maintaining both productivity and shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces radiated harmonics and provides RF isolation between components, enabling efficient signal transmission and reception while maintaining a compact and cost-effective packaging technology.
Implementation Method 1
The conductive features and the ground plane are configured to provide shielding for the RF component
Data Source
AI summary
Aspects of this disclosure relate to a shielded radio frequency component with an integrated antenna. An antenna can be on a first side of a multi-layer substrate and a radio frequency component can be disposed on a second side of the multi-layer substrate such that a ground plane of the multi-layer substrate is positioned between the antenna and the radio frequency component. Conductive features can be disposed around the radio frequency component and electrically connected to the ground plane. The conductive features and the ground plane can provide shielding for the radio frequency component. In certain embodiments, the conductive features can include bumps, such as solder bumps and/or copper pillars.