Integrated Antenna Test Socket with RF Probe
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Solution Overview
Problem
Current methods for end-of-line testing of electromagnetic performance of integrated RF transceivers with antennas-in-package (AiP) are inadequate, as existing approaches require soldering to a printed circuit board, making them unsuitable for effective testing.
Innovation Solution
A test setup and method utilizing a wafer chuck and test socket with resilient electric contacts to place the package on a carrier with an RF probe, allowing for near-field measurements of the integrated antenna, with far-field data calculated from these measurements, enabling efficient testing without soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the SiP is soldered to a PCB for testing, then the electromagnetic performance can be tested, but the approach is not suitable for EOL tests and increases device complexity
Solution Approach 1:
The testing process is segmented into two independent parts: electrical connection through the test socket with resilient contacts and electromagnetic measurement through the RF probe. This eliminates the need for soldering to PCB while enabling comprehensive testing of both electrical and electromagnetic performance.
Solution Approach 2:
The test socket with resilient electric contacts acts as an intermediary between the package interconnects and the testing equipment, providing stable electrical connection without requiring permanent soldering. The RF probe serves as an intermediary for electromagnetic field measurement, allowing non-contact measurement of antenna performance.
2Reliability
If the SiP is soldered to a PCB for testing, then complete module testing is possible, but this approach is not suitable for automated end-of-line testing
Solution Approach 1:
The test socket is pre-configured with resilient electric contacts that automatically make electrical connection when the package is placed on the carrier. The RF probe is pre-positioned to measure electromagnetic fields. This preliminary setup enables rapid automated testing without time-consuming soldering operations, significantly improving EOL test productivity.
Solution Approach 2:
The mechanical soldering process is replaced with a combination of resilient electrical contacts for electrical connection and RF probing for electromagnetic measurement. This substitution eliminates the need for thermal processing and permanent mechanical attachment, enabling faster automated testing while maintaining measurement accuracy.
3Measurement precision
If an RF probe is used for near-field measurements, then electromagnetic performance can be measured, but the measurement accuracy may be affected without proper antenna radiation path
Solution Approach 1:
The opening in the carrier extracts the electromagnetic radiation path from the package, allowing the RF probe to measure the near-field of the integrated antenna without interference from the carrier structure. This extraction of the measurement path enables accurate electromagnetic performance characterization.
Solution Approach 2:
The measurement is performed in the near-field dimension through the opening in the carrier, and then far-field radiation characteristics are calculated through mathematical transformation. This dimensionality change from near-field measurement to far-field characterization enables accurate antenna performance assessment without requiring far-field measurement setup.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate and efficient end-of-line testing of electromagnetic performance parameters such as EIRP and antenna gain for integrated RF transceivers with integrated antennas, facilitating improved quality control and compliance with safety standards like ISO 26262.
Implementation Method 1
using an RF probe mounted on the carrier to obtain near-field measurements of an electromagnetic field emanating from the integrated antenna
Implementation Method 2
The wafer chuck is configured to receive the package
Data Source
AI summary
A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.