Package-Integrated Antenna Waveguide for Dielectric-Limited Efficiency
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Solution Overview
Problem
Mold compounds and substrate materials with high dielectric constants in microelectronic packages interfere with the efficiency of embedded antennas, necessitating separate printed circuit boards, which are costly and complex.
Innovation Solution
A microelectronic package with a multilayer substrate featuring a conductive layer forming an antenna and a waveguide, where a tubular waveguide is mounted over the antenna, and a feed line with a conductive via traverses the dielectric layer to electrically couple the waveguide radiation receiver to a transmitter-receiver.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If antennas are embedded in molded microelectronic devices with mold compounds or substrate materials, then integration is improved, but antenna efficiency deteriorates due to high dielectric constants
Solution Approach 1:
The patent divides the antenna structure into multiple segments: a radiating element formed in a first conductor layer, a feed line in the same layer, and a ground plane in a second conductor layer separated by a dielectric layer. This segmentation allows each component to be optimized independently while maintaining overall integration within the package substrate.
Solution Approach 2:
The patent transitions from planar antenna designs to a three-dimensional structure by stacking conductor layers vertically with a dielectric layer in between. The radiating element in the first conductor layer is positioned at a specific height above the ground plane in the second layer, creating a vertical dimension that improves radiation characteristics while maintaining integration.
2Reliability
If antennas are placed on separate printed circuit boards or organic substrates, then antenna efficiency is improved, but device complexity and cost increase
Solution Approach 1:
The patent merges the antenna structure with the package substrate by forming both the antenna elements and the substrate interconnect structure together. The radiating element, feed line, and ground plane are integrated into the same multilayer substrate that also provides mechanical support and electrical interconnection, eliminating the need for separate PCBs or antenna modules.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it provides mechanical support for the semiconductor device, provides electrical interconnection through its conductor layers, and hosts the antenna radiating element and ground plane. This multi-functionality eliminates the need for separate dedicated antenna substrates or PCBs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient integration of antennas within microelectronic packages without the need for additional circuit boards, reducing complexity and cost while maintaining effective signal transmission and reception.
Implementation Method 1
a feed line coupling the waveguide radiation receiver to a transmitter-receiver, the feed line including a conductive via traversing the dielectric layer electrically coupling a first portion of the feed line in the first conductor layer to a second portion of the feed line in the second conductor layer
Implementation Method 2
a waveguide radiation receiver formed in a first conductor layer of a multilayer package substrate
Implementation Method 3
a tubular waveguide mounted to the multilayer package substrate such that a central aperture of the tubular waveguide is over the waveguide radiation receiver
Data Source
AI summary
A microelectronic package includes a waveguide radiation receiver formed in a first conductor layer of a multilayer package substrate, the multilayer package substrate comprising the first conductor layer spaced from a second conductor layer by a dielectric layer. The microelectronic package further includes a tubular waveguide mounted to the multilayer package substrate such that a central aperture of the tubular waveguide is over the waveguide radiation receiver, and a feed line coupling the waveguide radiation receiver to a transmitter-receiver, the feed line including a conductive via traversing the dielectric layer electrically coupling a first portion of the feed line in the first conductor layer to a second portion of the feed line in the second conductor layer, the first portion adjacent the waveguide radiation receiver, and the second portion adjacent the transmitter-receiver.