Integrated Array Sensor Driving Circuit Substrate Area
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Solution Overview
Problem
Existing array sensor technologies face reliability and area occupancy issues due to complex connecting paths between the system controller and driving lines, which are exacerbated by the use of Chip On Film (COF) and Film On Glass (FOG) bonding methods.
Innovation Solution
The array sensor apparatus integrates a driving circuit and a sensor circuit onto the same substrate, with transistors and conductive layers formed in a specific layered structure to reduce area occupation and improve reliability, allowing simultaneous formation without additional processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If COF and FOG bonding methods are used to connect driving chips to array sensor, then electrical connection is achieved, but device complexity and area occupancy increase
Solution Approach 1:
The patent merges the driving circuit and sensor circuit onto the same substrate, eliminating the need for separate driving chips and complex bonding processes. The driving transistor and sensing transistor are integrated in a single pixel cell structure, with shared conductive layers and insulating layers, thereby simplifying the overall device architecture and reducing connecting path complexity while maintaining electrical connection reliability.
2Reliability
If COF and FOG bonding methods are used to connect driving chips to array sensor, then electrical connection is achieved, but area occupancy increases
Solution Approach 1:
The patent combines the driving circuit and sensor circuit into the same substrate area, eliminating the need for separate driving chip modules. The integrated pixel cell structure shares conductive layers and insulating layers between driving and sensing functions, significantly reducing the total area occupied on the substrate while ensuring reliable electrical connections.
3Ease of manufacture
If driving circuit and sensor circuit are formed on separate substrates requiring bonding, then functional separation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent forms both the driving circuit and sensor circuit on the same substrate using the same thin film deposition and patterning processes. The multi-layer structure includes shared conductive layers, insulating layers, and semiconductor layers that are formed simultaneously for both driving and sensing functions, eliminating complex bonding steps and simplifying the manufacturing process while achieving functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces manufacturing complexity, enhances reliability, and minimizes area usage, while allowing for cost-effective and efficient production of array sensors.
Implementation Method 1
The visible lights are converted into electric signals by the photoelectric element 112 in the pixel cells of the array sensor 11
Data Source
AI summary
An array sensor apparatus and forming method thereof, wherein the array sensor comprises: a driving circuit and a sensor circuit, wherein the driving circuit and the sensor circuit are formed on the same substrate surface, the sensor circuit comprises a pixel cell array including pixel cells and driving lines connected with the pixel cells, output ends of the driving circuit are connected to the driving lines of the sensor circuit, the driving circuit comprises a first transistor, and the pixel cell comprises a second transistor. In the array sensor apparatus of the present disclosure, the driving circuit and the sensor circuit are formed on the same substrate surface, thus occupying less area. Reliability may be improved. Besides, the forming processes can be implemented simultaneously without additional processing steps.