Integrated Inductive Balun Package for MRI RF Coil Isolation
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Solution Overview
Problem
Existing MRI RF coils face challenges with large numbers of channels due to the need for multiple baluns, which occupy space, add weight, and can couple, leading to signal noise and common mode current issues.
Innovation Solution
A mechanical balun package comprising a plurality of inductive cable baluns sharing a set of resonant circuits, allowing for reduced balun packages, freeing up space and reducing weight while maintaining signal quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple individual baluns are used for each channel in MRI RF coils, then signal isolation and common mode current blocking are improved, but device weight and occupied space increase significantly
Solution Approach 1:
The patent combines multiple individual baluns into a single integrated balun package that serves multiple channels simultaneously. The shared resonant circuits and coupling structures allow one balun package to perform the function of what would traditionally require multiple separate baluns, thereby reducing overall weight while maintaining signal isolation through careful design of coupling paths and resonant frequencies.
2Reliability
If multiple individual baluns are used for each channel in MRI RF coils, then common mode current blocking is improved, but device complexity and assembly difficulty increase
Solution Approach 1:
Multiple balun functions are merged into a single package with shared resonant circuits and coupling structures, reducing the number of discrete components that need to be assembled and managed, thereby simplifying the overall device complexity while maintaining common mode current blocking capability.
Solution Approach 2:
The balun package is designed to serve multiple channels simultaneously with a single structure that performs the function of multiple individual baluns. This multi-functional design reduces complexity by eliminating the need for separate assemblies for each channel while maintaining the necessary isolation and blocking properties.
3Ease of manufacture
If traditional separate balun packages are used, then manufacturing simplicity is maintained, but space occupation and weight increase
Solution Approach 1:
The patent merges multiple balun functions into a single integrated package, significantly reducing the total area occupied by balun components in the MRI RF coil assembly. The shared resonant circuits and coupling structures allow compact arrangement that fits within the constrained space of modern high-channel-count MRI coils.
4Reliability
If multiple individual baluns are used, then channel isolation is improved, but inductive coupling between baluns causes signal noise
Solution Approach 1:
The patent introduces carefully designed coupling structures and resonant circuits that act as intermediaries between channels, controlling and managing the inductive coupling effects. By designing the coupling paths with specific resonant frequencies and impedance characteristics, the system maintains channel isolation while minimizing harmful signal noise from coupling between adjacent channels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decouples inductive cable baluns, preventing common mode current passage between cable bundles, thereby optimizing space, weight, and user experience.
Implementation Method 1
A first cable bundle that is wound to form the inductor of the first resonant circuit or is spaced from and inductively coupled to the inductor of the first resonant circuit
Data Source
AI summary
The present disclosure is directed to a balun package comprising a set of inductive baluns for a magnetic resonance imaging (MRI) radio frequency (RF) coil. A first resonant circuit and a second resonant circuit each comprise an inductor. A first decoupling circuit leg is between and shared by the first and second resonant circuits and includes one or more decoupling inductors and/or one or more decoupling capacitors. A first cable bundle is wound to form the inductor of the first resonant circuit or is otherwise spaced from and inductively coupled to the inductor of the first resonant circuit.


