Integrated Balun Planar Antenna for Tile Architecture

Solution Overview

Problem

Current tile architecture antenna designs face limitations in bandwidth and integration due to the need for height in the Z-direction, especially when incorporating baluns, which complicates the integration of antennas, baluns, and electronics, and requires complex fabrication processes.

Innovation Solution

A low profile wideband planar antenna element is designed using standard printed circuit board (PCB) techniques, incorporating a multilayer structure with electromagnetic band gap (EBG) patches and baluns displaced in the Z-direction, allowing for a compact, highly integrated design that can be fabricated using standard PCB processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If a bowtie antenna is placed over an electromagnetic band gap (EBG) material to maintain impedance bandwidth, then the bandwidth is preserved, but the design requires additional height in the Z-direction and complicates the integration with baluns and electronics

Engineering Contradiction:
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The patent merges the balun and antenna elements into a single integrated structure where the balun is formed as part of the antenna substrate assembly. This integration eliminates the need for separate balun components and reduces the overall height requirement, resolving the contradiction between maintaining bandwidth and reducing integration complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a three-dimensional stacked architecture to a planar two-dimensional design by forming the balun and antenna elements on the same substrate plane. This dimensional change allows for simplified integration while maintaining the required bandwidth performance

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If conventional baluns are integrated into the antenna design, then the antenna can be driven by differential signals, but the design requires considerable height in the Z-direction which limits integration into multiple components

Engineering Contradiction:
Core Design Contradiction:
Adaptability or versatilityVSLength of stationary object

Solution Approach 1:

The balun and antenna are merged into a single integrated component where the balun transmission lines are formed on the same substrate as the antenna elements. This merging eliminates the need for separate balun components and reduces the Z-direction height, enabling better integration while maintaining differential signal compatibility

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The design transitions from a vertical stacked architecture to a planar layout where balun and antenna elements coexist on the same substrate plane. This dimensional transformation reduces the required height in the Z-direction while preserving signal compatibility

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of manufacture

If a tile architecture antenna design is implemented to reduce cost and improve manufacturability, then integration is improved, but the bandwidth of such antennas is limited

Engineering Contradiction:
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The patent combines the balun and antenna into a single tile architecture component that can be manufactured using standard PCB processes. This integration maintains the manufacturing advantages of tile architecture while extending the bandwidth through the unified design structure

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated balun-antenna tile design serves multiple functions within a single component: it provides both the signal conditioning function of a balun and the radiation function of an antenna. This multi-functionality maintains ease of manufacture while expanding bandwidth capabilities

Inventive Principle:
Principle #6Universality (Multi-functionality)

4Ease of manufacture

If the antenna is made planar using traditional PCB manufacturing processes for high integration, then fabrication is simplified, but the required height in the Z-direction for broadband performance cannot be achieved

Engineering Contradiction:
Core Design Contradiction:
Ease of manufactureVSLength of stationary object

Solution Approach 1:

The patent merges the balun and antenna elements into a single planar structure that can be fabricated using traditional PCB processes. This integration allows the design to achieve broadband performance without requiring additional height in the Z-direction, as both functions are realized within the same planar substrate

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a compact, efficient, and easily manufacturable wideband planar antenna system with improved bandwidth and integration capabilities, suitable for highly integrated arrays and communication systems, while maintaining impedance bandwidth and pattern performance.

Implementation Method 1

Prior art publications have disclosed that placing a bowtie antenna over an electromagnetic band gap (EBG) material allows for the bowtie antenna to keep its impedance bandwidth while preserving the pattern performance in that band

Methodology Applied
Scientific EffectElectromagnetic band gap:

Data Source

PatentUS9929470B2Low profile wideband planar antenna element with integrated baluns
Publication Date: 2018.03.27
  • US9929470B2 patent drawing
  • US9929470B2 patent drawing
  • US9929470B2 patent drawing

AI summary

An antenna assembly for use in a tile architecture antenna system. The antenna assembly comprises: i) a first substrate layer having a first surface; ii) a first antenna disposed in an X-Y plane on the first surface of the first substrate layer; iii) a second substrate layer having a first surface, the second substrate layer displaced in the Z-direction with respect to the X-Y plane on the first surface of the first substrate layer; and iv) a first tuning balun disposed on the first surface of the second substrate layer and coupled to the first antenna by means of a first feed via. The antenna assembly further comprises a first transmission line disposed on the first surface of the second substrate layer. The first transmission line is coupled to the first antenna by means of a second feed via.