Integrated Baseband and Memory Package for Wireless Devices
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Solution Overview
Problem
In wireless communication devices, the external memory package requires a large number of package pins and PCB conducting paths for signal transmission, leading to increased size, cost, and lower signal quality due to the baseband processing package interface.
Innovation Solution
Integrating the processing circuit and memory into a single semiconductor package, eliminating the need for package pins between them and reducing the number of PCB conducting paths, thereby improving signal quality and operation speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the memory package is installed external to the baseband processing package, then the wireless communication device can be manufactured with separate functional modules, but the number of package pins and PCB conducting paths increases, leading to larger device size and higher cost
Solution Approach 1:
The patent combines the baseband processing package and memory package into a single integrated package. The processing circuit and memory are packaged together in one semiconductor package, eliminating the need for separate external connections. This merging reduces the number of package pins required and decreases the overall device area occupied by inter-package connections.
2Ease of manufacture
If the memory package is installed external to the baseband processing package, then the wireless communication device can use separate functional modules, but the number of PCB conducting paths increases, leading to lower signal quality and limited operation speed
Solution Approach 1:
The patent merges the processing circuit and memory into a single package, eliminating external PCB conducting paths between them. This integration removes the signal quality degradation and speed limitations caused by long external traces, as data transfer occurs through internal package connections instead of external PCB paths.
3Ease of manufacture
If the memory package is installed external to the baseband processing package, then the wireless communication device can use separate functional modules, but the interface between packages occupies large area, causing design difficulties
Solution Approach 1:
The patent integrates the processing circuit and memory within a single semiconductor package, eliminating the need for complex external interfaces between separate packages. This merging simplifies the overall device architecture by removing the need for multiple package interfaces and their associated routing complexity.
Data Source
AI summary
A wireless communication device including an integrated processing circuit and a first memory is provided. The integrated processing circuit includes a processing unit capable of processing a wireless communication signal and a radio frequency (RF) unit capable of performing a conversion between a radio frequency (RF) signal and a baseband signal, wherein the wireless communication signal is one of the RF signal and the baseband signal. The first memory is coupled to the integrated processing circuit. The first memory is capable of storing data used by the processing unit, wherein the integrated processing circuit and the first memory are packaged in a single semiconductor package.