Integrated Base Plate Cooling for Compact Power Modules
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Solution Overview
Problem
Existing electronic power modules face challenges in achieving efficient cooling while maintaining stability, leading to increased volume, thickness, and weight due to high pressure forces from coolant flow, which are mitigated by separate cooling structures.
Innovation Solution
The cooling structure is integrally formed with the base plate, providing enhanced stiffness and stability through wall structures that guide coolant flow and reduce overall height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate cooling structure is attached to the base plate to transport heat away, then cooling efficiency is improved, but the electronic power module becomes more susceptible to high pressure forces and micro fractures
Solution Approach 1:
The cooling structure is integrally formed with the base plate as a single piece, merging two previously separate components. This integration ensures that the cooling structure and base plate move together as one unit, eliminating relative motion and stress concentration at joints, thereby maintaining mechanical stability while achieving effective cooling.
Solution Approach 2:
The base plate is designed to serve multiple functions: it provides mechanical support for mounting electronic components and simultaneously acts as an integral cooling structure with coolant channels. This multi-functionality eliminates the need for separate cooling components, reducing the risk of micro fractures while maintaining cooling efficiency.
2Reliability
If the base plate is thickened to prevent mechanical failure under high pressure, then reliability is improved, but volume, weight and overall height increase
Solution Approach 1:
The base plate features locally reinforced regions with increased thickness specifically at areas subjected to high pressure forces, such as around mounting holes and coolant channel intersections. Other areas maintain standard thickness, optimizing the balance between mechanical strength and weight reduction.
Solution Approach 2:
The base plate incorporates curved and rounded transitions instead of sharp corners, particularly at stress concentration points. These curved features distribute stress more evenly, enhancing mechanical stability without requiring uniform thickening of the entire base plate, thus reducing overall weight.
3Reliability
If the base plate is thickened to prevent mechanical failure under high pressure, then reliability is improved, but volume and overall height increase
Solution Approach 1:
The base plate features locally reinforced regions with increased thickness specifically at areas subjected to high pressure forces, such as around mounting holes and coolant channel intersections. Other areas maintain standard thickness, optimizing the balance between mechanical strength and volume reduction.
4Temperature
If a separate cooling structure is attached to the base plate, then cooling function is added, but device complexity increases
Solution Approach 1:
The cooling structure is integrally formed with the base plate as a single piece, merging two previously separate components. This integration eliminates the need for separate assembly steps, reducing manufacturing complexity while maintaining effective cooling function.
Solution Approach 2:
The base plate is designed to serve multiple functions: it provides mechanical support for mounting electronic components and simultaneously acts as an integral cooling structure with coolant channels. This multi-functionality eliminates the need for separate cooling components, simplifying the overall device structure and assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration enhances stability and reduces module size without compromising cooling efficiency, addressing the issues of volume and weight while maintaining effective heat dissipation.
Implementation Method 1
the coolant will be guided through the cooling structure to absorb excess heat and transport it away from the electronic power module
Implementation Method 2
transport it away from the electronic power module
Implementation Method 3
a material which is designed to undergo a phase transition during the cooling cycle may be used, to form a phase-change or two-phase cooling system
Implementation Method 4
an expansion device which vaporises the liquid. The evaporating liquid undergoes a phase change and absorbs heat from the cooling structure in the process
Data Source
AI summary
The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).