Integrated Battery Package Assembly for Heat-Safe Semiconductor Packaging
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Solution Overview
Problem
Mounting external batteries to packaged integrated circuits adds bulk, decreases reliability, and complicates manufacturing processes, as conventional button batteries cannot withstand high temperatures and are prone to deformation, leading to mechanical and electrical failures.
Innovation Solution
Incorporating a battery into the device package by bonding it to a carrier substrate with conductive leads and a molded cover, using low-temperature bonding agents to avoid exposure to excessive temperatures during manufacturing, enabling panel-level assembly and singulation into individual devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional button batteries are externally mounted to packaged integrated circuits, then the device can be powered, but the device adds bulk and decreases reliability
Solution Approach 1:
The battery is integrated directly into the molded package structure, merging two previously separate components (battery and package) into a single unified assembly. This eliminates the need for external mounting hardware and reduces overall device complexity while improving reliability through integrated protection.
Solution Approach 2:
The battery is nested within the molded package cavity, with the package structure serving as a protective enclosure. This nesting approach allows the battery to be housed within the existing package footprint without adding external bulk, while the molded cover provides mechanical protection and environmental sealing.
2Productivity
If conventional button batteries are mounted externally, then the device can be powered, but manufacturing processes are complicated due to temperature constraints
Solution Approach 1:
The battery is positioned and secured within the molded package cavity before the final molding step is completed. This preliminary positioning allows subsequent high-temperature manufacturing processes to be applied to the entire assembly without requiring separate, temperature-sensitive battery mounting steps.
Solution Approach 2:
The battery mounting and package molding operations are merged into a single integrated process. The battery is placed in the mold cavity along with the package components, and the entire assembly is molded together in one operation, eliminating sequential assembly steps and improving manufacturing efficiency.
3Reliability
If conventional button batteries are used, then low cost and high capacity-to-volume ratio are achieved, but the batteries are prone to deformation and mechanical failures
Solution Approach 1:
The molded package structure serves as a protective cushioning enclosure for the battery, absorbing mechanical stresses and preventing deformation before they can affect the battery. The molded cover and cavity provide pre-engineered mechanical protection against impacts, compression, and environmental factors.
Solution Approach 2:
The package structure uses composite materials that combine mechanical strength, flexibility, and environmental resistance. The molded package typically combines rigid support structures with flexible sealing materials, creating a composite system that protects the battery from mechanical failures while maintaining its operational integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the integration of batteries without damaging them during manufacturing, maintaining reliability and simplifying the assembly process, while enabling high-volume production of device packages with integrated batteries.
Implementation Method 1
a first conductive lead embedded within the molded cover that electrically couples the first terminal of the battery to the first contact pad
Implementation Method 2
bonding agents
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
Electronic device packages that allow batteries to be incorporated in the package directly above or below semiconductor die or other devices can enable reduced package footprints while also protecting batteries against exposure to undesirable high temperatures during assembly of the package and protecting molded portions of the package from stresses that may arise from swelling of the battery over its useful lifetime. One terminal of the battery is bonded a conductive lead integrated within a molded cover by an electrically conductive bond. Bonding the cover to a circuit board or other substrate also electrically couples to battery terminal to a contact on the substrate. The other terminal of the batter can be bonded to another contact on the substrate using a suitable conductive bond such as one formed by an electrically conductive adhesive.