Integrated bonding mid clamp device, system, and method for solar panel mounting and grounding

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Solution Overview

Problem

Existing solar array mounting systems face challenges in creating effective electrical contact between solar panel frames and grounding paths due to the insulative anodized layers, requiring the breaking or piercing of these layers to establish conductivity, which can be inefficient and non-uniform.

Innovation Solution

An integrated bonding mid clamp system featuring a deformable toothed washer and tightening mechanism that breaks the anodized layer of solar panel frames to establish a secure and conductive connection with the support rail, ensuring uniform contact and conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the ground path runs through the anodized aluminum frame, then the structural integrity and corrosion resistance of the frame are maintained, but the electrical conductivity is blocked due to the insulative anodized layer

Engineering Contradiction:
Improveelectrical conductivityVSAvoidinsulative anodized layer
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent extracts or removes the anodized layer from specific contact areas of the aluminum frame using a scraping mechanism. The mid clamp device includes a scraping surface that physically removes the insulative anodized coating to expose the conductive aluminum substrate, thereby establishing electrical contact while preserving the anodized layer in non-contact areas for corrosion protection.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a conductive intermediary material or mechanism between the mid clamp and the anodized aluminum frame. This intermediary either conducts electricity through the anodized layer or creates a conductive path that bypasses the insulative barrier, enabling electrical connectivity without completely removing the protective coating.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the anodized layer is broken to establish electrical contact, then conductivity is achieved, but the contact area and uniformity of contact are reduced

Engineering Contradiction:
Improveelectrical conductivityVSAvoidcontact uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent employs a deformable scraping surface or mechanism that adapts to the contours of the solar panel frame during installation. This dynamic element ensures uniform pressure distribution and consistent contact across the entire bonding interface, creating uniform electrical contact while effectively breaking the anodized layer across the full contact area.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent transitions from point or line contact to surface contact by designing a scraping surface that engages with the frame over an extended area. This dimensional change from discrete contact points to continuous surface contact improves both the uniformity of electrical connection and the overall contact area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Ease of operation

If a traditional clamping mechanism is used, then the installation process is simple, but the electrical bonding and grounding effectiveness is insufficient

Engineering Contradiction:
Improveinstallation simplicityVSAvoidgrounding effectiveness
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent combines multiple functions into a single integrated mid clamp device: mechanical clamping, electrical bonding, and grounding. The device simultaneously secures the solar panel frame mechanically while scraping the anodized layer to create electrical contact, thereby achieving both structural attachment and electrical grounding in one operation without requiring separate steps.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mid clamp device is designed as a multi-functional component that performs both mechanical fastening and electrical bonding tasks. It serves as a structural connector while also establishing the grounding path, eliminating the need for separate bonding wires or additional grounding components and simplifying the overall installation process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system securely clamps solar panel frames to support rails while breaking the anodized layer to facilitate electrical conductivity, ensuring compliance with safety regulations and enhancing the structural rigidity and electrical connection of solar arrays.

Implementation Method 1

the deformable toothed washer is configured to deform into the recessed area when the tightening mechanism clamps the mid clamp portion to the solar panel frame, wherein the projections of the deformable toothed washer are configured to break an anodized layer of the solar panel frame

Methodology Applied
Scientific EffectMechanical deformation: Deformation

Data Source

PatentUS12018862B2Integrated bonding mid clamp device, system, and method for solar panel mounting and grounding
Publication Date: 2024.06.25 SOLAR FOUNDATIONS USA INC
  • US12018862B2 patent drawing
  • US12018862B2 patent drawing
  • US12018862B2 patent drawing

AI summary

Disclosed herein is an integrated bonding mid clamp device for solar panel mounting and grounding, as well as a related system and method. The integrated bonding mid clamp includes a deformable toothed washer for breaking an anodized layer of a solar panel frame. The deformable toothed washer is capable of deforming to avoid obstructing proper contact between the mid clamp and the solar panel frame.