Integrated Camera Module with Shared VCSEL Light Source
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Solution Overview
Problem
Electronic devices with multiple sensors, such as depth measurement sensors and infrared cameras, often have increased footprint, durability issues, and manufacturing complexity due to individual light sources for each sensor, leading to larger size, higher costs, and reduced signal transfer speed.
Innovation Solution
Integration of time of flight sensors and infrared camera sensors into a single module package, sharing a common light source, such as a VCSEL, to reduce component count and space usage, while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple sensors with individual light sources are used, then each sensor can perform its function independently, but the device footprint increases and durability decreases
Solution Approach 1:
The patent combines multiple sensors (time of flight sensor and infrared camera sensor) and their light sources into a single integrated sensor package. This merging reduces the overall device footprint while maintaining the functionality of each sensor, directly addressing the contradiction between compact size and sensor independence.
Solution Approach 2:
The integrated sensor package enables a single light source to serve multiple sensors simultaneously, creating a multi-functional system. This universal approach allows the device to maintain multiple sensing capabilities without proportionally increasing the footprint, thereby improving durability through reduced component count while preserving functional independence.
2Ease of manufacture
If multiple individual light sources are used for different sensors, then each sensor has dedicated illumination, but manufacturing complexity increases and costs rise
Solution Approach 1:
The patent merges multiple light sources and sensors into a single integrated package, reducing the total component count. This consolidation simplifies the manufacturing process by reducing assembly steps and inventory management requirements, directly addressing the contradiction between manufacturing ease and component quantity.
Solution Approach 2:
The integrated package creates a universal component that serves multiple sensing functions simultaneously. This multi-functionality reduces the overall component count needed in the device, thereby simplifying manufacturing operations and reducing associated costs while maintaining dedicated illumination capabilities for each sensor type.
3Speed
If sensors are positioned adjacent to each other with dedicated light sources, then each sensor operates independently, but signal transfer speed decreases
Solution Approach 1:
The patent merges the light sources and sensors into a closely integrated package, reducing the physical distance light signals must travel between components. This consolidation increases signal transfer speed while the systematic arrangement within the integrated package manages the complexity of having multiple sensors share space efficiently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces device size, improves durability, enhances signal transfer speed, and simplifies manufacturing, while maintaining sensor performance by using a shared light source for integrated time of flight and infrared camera sensors.
Implementation Method 1
a VCSEL, to reduce component count and space usage
Implementation Method 2
integrated time of flight sensors
Data Source
AI summary
Systems, methods, and computer-readable media are disclosed for camera modules having integrated time of flight sensors. In one embodiment, an integrated sensor module may include a substrate, a molding compound disposed on the substrate, and a camera sensor disposed on the substrate. The integrated sensor module may include a vertical-cavity surface-emitting laser assembly (VCSEL) disposed on the molding compound and separated from the substrate by a first distance, and a single photon avalanche photodiode assembly (SPAD) disposed on the molding compound and separated from the substrate by the first distance. The camera sensor may be configured to detect a first portion of light emitted by the VCSEL and reflected from an object, and the SPAD may be configured to detect a second portion of light emitted by the VCSEL and reflected from the object.