Integrated Capacitor Arrays for Semiconductor Noise Filtering

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Solution Overview

Problem

Highly integrated semiconductor memory devices experience increased signal noise due to higher clock frequencies, which existing capacitance-based noise filters struggle to effectively mitigate.

Innovation Solution

A semiconductor device design featuring multiple capacitor arrays with integral upper electrodes and landing pads to minimize electrical resistance and enhance effective capacitance, connecting capacitors in series and parallel configurations to improve noise filtering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If clock frequency is increased to increase operation speed, then operation speed is improved, but signal noise between power signals increases

Engineering Contradiction:
Improveoperation speedVSAvoidsignal noise
Core Design Contradiction:
SpeedVSObject-affected harmful factors

Solution Approach 1:

Multiple capacitor arrays are merged into a single integrated capacitor structure with shared electrodes. The first and second capacitor arrays share a common upper electrode, while the second and third capacitor arrays share a common lower electrode, creating a unified noise filtering system that effectively mitigates signal noise while supporting high-speed operations

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If conventional capacitor structures are used, then manufacturing is simpler, but effective capacitance is insufficient to filter noise at high frequencies

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidnoise filtering effectiveness
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

Capacitor arrays are nested within a shared electrode structure. The first, second, and third capacitor arrays are positioned adjacent to each other and share common electrodes, creating a compact nested arrangement that increases effective capacitance without complicating the manufacturing process

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The electrical parameters of the capacitor structure are optimized by configuring multiple capacitor arrays with specific capacitance values (e.g., 0.5 pF to 2.0 pF per capacitor) and arranging them in combinations that achieve the desired total capacitance (e.g., 1.0 pF to 4.0 pF) for effective high-frequency noise filtering

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively reduces electrical resistance and enhances capacitance, effectively filtering signal noise and improving the operational speed of semiconductor memory devices.

Implementation Method 1

A capacitance is used as a noise filter to obviate this problem

Methodology Applied
Scientific EffectCapacitance: Capacitance

Implementation Method 2

minimize electrical resistance and enhance effective capacitance

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Data Source

PatentUS9806080B2Semiconductor devices and methods of manufacturing the same
Publication Date: 2017.10.31 SAMSUNG ELECTRONICS CO LTD
  • US9806080B2 patent drawing
  • US9806080B2 patent drawing
  • US9806080B2 patent drawing

AI summary

A semiconductor device includes a substrate, a memory structure and a capacitor structure including at least one array of capacitors. The memory structure is disposed in a first region of the device. The capacitor structure is disposed in a second region of the device. The capacitor structure may include a first capacitor array, a second capacitor array, a third capacitor array and a first landing pad. The first landing pad is disposed between the substrate and lower electrodes of capacitors of the first and second capacitor arrays, and contacts the lower electrodes so as to electrically connect the first capacitor array and the second capacitor array. Upper electrodes of capacitors of the second and third capacitor arrays are integral such that the second capacitor array and the third capacitor array are electrically connected to each other.