Integrated Capacitor Coil Assembly for High-Density Mounting
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Solution Overview
Problem
Conventional methods for combining coils and capacitors on a mounting board face challenges in high-density mounting and productivity due to the need for separate mounting areas and frequent transportation of components.
Innovation Solution
An electronic device design where capacitors and a coil are integrated via a case, with conductive terminals connecting them, allowing for high-density mounting and simplification of the assembly process, while also enabling flexible electrical connections and improved insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the coil and capacitor are individually mounted on the board, then the mounting is flexible and easy, but the area for mounting both components needs to be secured and productivity decreases
Solution Approach 1:
The patent combines the coil and capacitor into a single integrated component unit that is mounted as one assembly on the board. This merging of previously separate components reduces the total mounting area required and eliminates the need for multiple separate mounting operations, thereby improving productivity while maintaining electrical functionality.
2Ease of operation
If the coil and capacitor are individually mounted on the board, then each component can be positioned independently, but the mounting process becomes complex and time-consuming
Solution Approach 1:
By integrating the coil and capacitor into a single mountable unit with pre-established electrical connections, the patent simplifies the mounting process from multiple independent operations to a single assembly installation. This reduces process complexity and time while maintaining the ability to achieve required electrical connections.
3Area of stationary object
If the coil and capacitor are mounted close together for high-density mounting, then space is saved, but insulation between components becomes difficult to secure
Solution Approach 1:
The integrated design incorporates internal insulation structures and spacing mechanisms within the unified component assembly. This allows the coil and capacitor to be positioned in close proximity on the board while maintaining adequate electrical insulation through the integrated construction, thereby achieving high-density mounting without compromising reliability.
Data Source
AI summary
An electronic device includes first and second capacitors, a case, a coil, and first to fourth conductive terminals. The first capacitor includes first and second terminal electrodes. The second capacitor includes third and fourth terminal electrodes. The case includes an accommodation recess for accommodating the first and second capacitors. The coil is separated from the first and second capacitors by a part of the case and disposed outside the accommodation recess. The first terminal is connected to the first electrode and partly disposed on a mounting-side bottom surface of the case. The second terminal is connected to one end of the coil and the second electrode and partly disposed on the surface. The third terminal is connected to the other end of the coil and the third electrode and partly disposed on the surface. The fourth terminal is connected to the fourth electrode and partly disposed on the surface.