Integrated Capacitor Inductor Wiring Board

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional wiring boards face challenges in achieving a compact size and low cost while maintaining multifunctionality due to the need for separate mounting spaces and processes for inductors and resistors, which restricts further size reduction and increases production costs.

Innovation Solution

A wiring board design featuring a ceramic capacitor with alternately laminated inner electrode layers and a dielectric layer, where inductors or resistors are formed on or within the capacitor, allowing for integrated circuit configuration and eliminating the need for separate mounting spaces, thus enabling a compact and cost-effective solution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If inductors and resistors are surface-mounted in vacant spaces on the wiring board, then multifunctionality is achieved, but the board size increases and manufacturing complexity increases

Engineering Contradiction:

ImprovemultifunctionalityVSAvoidboard size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent merges the capacitor and inductor into a single integrated component. The inductor is formed by winding a conductor around the capacitor body, allowing both components to occupy the same space and function simultaneously, thereby reducing board size while maintaining multifunctionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated component serves multiple functions: the capacitor provides capacitance for power supply stabilization, while the wound conductor provides inductance for filtering or impedance matching. This multi-functional design eliminates the need for separate inductor and resistor components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If inductors and resistors are surface-mounted separately, then circuit functionality is achieved, but the number of manufacturing processes increases

Engineering Contradiction:

Improvecircuit functionalityVSAvoidmanufacturing efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent combines the capacitor and inductor manufacturing into a single integrated process. The inductor conductor is wound around the capacitor during capacitor fabrication, eliminating separate mounting steps and reducing manufacturing complexity while maintaining full circuit functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If separate mounting spaces are allocated for inductors and resistors, then proper electrical connections are achieved, but the wiring board becomes less compact

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidwiring board volume

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The inductor conductor is nested around the capacitor body, with the capacitor core positioned centrally within the inductor winding structure. This nested arrangement allows both components to share the same spatial envelope, reducing overall volume while maintaining proper electrical connections through the capacitor's terminal electrodes.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design allows for multifunctional and high-performance features by integrating inductors or resistors within the capacitor, reducing the board's size and production complexity, while ensuring stable power supply and efficient electrical connections.

Implementation Method 1

first inner electrode layers and second inner electrode layers are alternately laminated and arranged via a dielectric layer

Methodology Applied

Scientific EffectDielectric insulation: Dielectric

Data Source

PatentUS7742314B2Wiring board and capacitor

Publication Date: 2010.06.22 NITERRA CO LTD

AI summary

A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E,101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistor (301, 302, 311, 312, 321, 322) is formed on or in the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101′, 1101″, 1101′″, 1101″″, 1101′″″).