Integrated Electrochemical Cells on Circuit Boards to Cut Failure Points
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Solution Overview
Problem
Conventional electrochemical cells are not directly integrated into circuits during manufacturing, requiring separate mechanical and electrical integration processes that are costly, time-consuming, and create additional failure points.
Innovation Solution
Electrochemical cells are directly integrated with circuit devices during manufacturing, sharing components and eliminating intermediate connections, through methods such as printing components on a circuit board and forming electrical connections directly with current collectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrochemical cells are manufactured as standalone devices and then integrated into circuits, then manufacturing precision and reliability are maintained, but device complexity and manufacturing cost increase due to separate fabrication and integration processes
Solution Approach 1:
The patent combines the electrochemical cell fabrication process with the circuit board manufacturing process into a single integrated operation. The cell components (electrodes, electrolyte, packaging layers) are formed directly on the circuit board substrate, eliminating the need for separate cell manufacturing and subsequent integration steps. This merging of processes reduces device complexity while maintaining reliability through consistent manufacturing conditions.
Solution Approach 2:
The circuit board substrate serves multiple functions: it acts as the structural base for the circuit, the packaging layer for the electrochemical cell, and the substrate for forming electrodes and conductive pathways. This multi-functionality eliminates the need for separate components for each function, reducing overall device complexity while maintaining manufacturing precision.
2Manufacturing precision
If separate mechanical and electrical integration processes are used, then manufacturing precision is maintained, but productivity decreases due to additional operation steps
Solution Approach 1:
The patent merges mechanical attachment and electrical connection operations into a single simultaneous process. As the cell components are formed directly on the circuit board, mechanical bonding and electrical conductivity are established concurrently, eliminating the need for separate mechanical and electrical integration steps. This increases productivity while maintaining precision through controlled deposition and formation processes.
Solution Approach 2:
The circuit board is prepared in advance with pre-formed electrodes, conductive pathways, and packaging structures before the electrochemical cell assembly is completed. This preliminary preparation allows subsequent cell formation to proceed rapidly without requiring time-consuming separate integration operations, thereby increasing productivity while maintaining precision.
3Manufacturing precision
If conventional standalone cell fabrication is used, then manufacturing precision is maintained, but loss of time increases due to separate manufacturing and integration processes
Solution Approach 1:
The patent combines cell fabrication and circuit integration into a single continuous manufacturing process. All cell components are formed directly on the circuit board in one manufacturing run, eliminating the time required for separate cell fabrication, transportation, and integration operations. This reduces time loss while maintaining precision through consistent in-line manufacturing conditions.
Solution Approach 2:
Critical cell components and circuit structures are pre-formed on the substrate before final cell assembly. This preliminary action allows the remaining steps to proceed rapidly without requiring time-consuming separate fabrication and integration operations, thereby reducing overall time loss while maintaining manufacturing precision.
4Reliability
If additional integration components and operations are used, then reliability is maintained through redundancy, but device complexity and cost increase
Solution Approach 1:
The patent eliminates the need for separate mechanical fasteners, connectors, and bonding materials by integrating all structural and electrical functions into the circuit board substrate itself. This reduction in components simplifies manufacturing while maintaining reliability through the inherent stability of the integrated structure and reduced number of potential failure points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration reduces manufacturing costs and complexity, increases reliability, and minimizes failure points by sharing components and eliminating redundant operations.
Implementation Method 1
an electrolyte layer, disposed and providing ionic communication between the positive electrode and the negative electrode
Data Source
AI summary
Provided are electronic circuits, comprising electrochemical cells directly integrated with other devices of the circuits, and methods of manufacturing these circuits. The direct integration occurs during cell manufacturing, which allows sharing components, reducing operation steps and failure points, and reducing cost and size of the circuits. For example, a portion of a cell enclosure may be formed by a circuit board, providing direct mechanical integration. More specifically, the cell is fabricated right on the circuit board. In the same or other examples, one or both cell current collectors extend outside of the cell boundary and used by other devices, providing direct electrical integration without a need for intermediate connections and eliminating additional failure points. Furthermore, printing one or more components of electrochemical cells, such as electrolytes and current collectors, allows achieving higher levels of mechanical and electrical integration that are generally not available in conventional cells.