Integrated Ceramic Disc-Shaft Structure for Stronger Semiconductor Heaters
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Solution Overview
Problem
Existing semiconductor manufacturing apparatus members with ceramic heaters face challenges in manufacturing due to thermal history-induced sintered particle growth, leading to strength reduction and bonding interface separation, and difficulty in integrating a power supply member with a solid shaft.
Innovation Solution
A ceramic member for semiconductor manufacturing apparatus with a ceramic disc and shaft integrated without a bonding interface, featuring a recessed surface inside the shaft for electrode exposure and a frustoconical inner space for easy mold core withdrawal, allowing for single thermal history firing and reduced sintered particle growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the disc and shaft are separately produced by firing and then bonded together by heat treatment, then the manufacturing process is simple, but sintered particles grow, decreasing the strength and causing bonding interface separation
Solution Approach 1:
The disc and shaft are integrated as a single piece before firing, eliminating the bonding interface. This merging approach allows the entire structure to be fired once, preventing sintered particle growth at interfaces and maintaining high strength throughout the component.
Solution Approach 2:
The disc and shaft are integrated in the green state (before firing) rather than after firing. This preliminary integration avoids the need for subsequent bonding heat treatment, preventing the thermal history that causes sintered particle growth and strength degradation.
2Adaptability or versatility
If a hollow shaft is used to accommodate the power supply member, then the power supply can be integrated, but a relatively deep hole for the power supply member needs to be formed in the disc, making manufacturing difficult
Solution Approach 1:
The shaft is designed with a localized recessed portion at its lower end that matches the depth of the electrode exposure hole. This local structural modification allows the power supply member to be accommodated without requiring a deep hole through the entire disc, simplifying the manufacturing process while maintaining electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a strong, easy-to-manufacture ceramic member with no bonding interface separation, achieving increased strength and simplified electrode exposure hole formation by integrating the disc and shaft without a bonding interface and applying a single thermal history.
Implementation Method 1
a disc and a shaft are separately produced by firing
Data Source
AI summary
A member for a semiconductor manufacturing apparatus includes a ceramic disc incorporating an electrode and a ceramic cylindrical shaft supporting the disc. The disc and the shaft are integrally formed and mutually have no bonding interface. The disc has a surface with which the shaft is integrated. The surface has a region inside the shaft and a region outside the shaft. The region inside the shaft is recessed by one step with respect to the region outside the shaft and has an electrode exposure hole through which the electrode is exposed.