Integrated Charging Coil Module for Shorter Wireless Power Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wireless charging technologies have a long power supply path, leading to significant losses and low efficiency due to the electrical connection of charging coils through multiple board-to-board connectors, which increases complexity and cost.
Innovation Solution
The integration of a charging coil module with a circuit board, where the substrate of the charging coil is between the first and second coils, and the substrate of the circuit board is between the first and second wiring layers, allowing direct electrical connections, reducing the power supply path and eliminating the need for board-to-board connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the charging coil is electrically connected to the circuit board through multiple board-to-board connectors, then the charging coil can be separately manufactured and assembled, but the power supply path becomes long and energy loss increases
Solution Approach 1:
The patent merges the charging coil and circuit board into a single integrated structure where the coil substrate and circuit board substrate are bonded together, eliminating the need for separate board-to-board connectors. This integration shortens the power supply path and reduces energy loss while maintaining manufacturing feasibility through standardized integration processes.
2Ease of operation
If the charging coil and circuit board are separately manufactured and connected through BTB connectors, then assembly flexibility is improved, but device thickness increases
Solution Approach 1:
The charging coil substrate and circuit board substrate are integrated into a single bonded structure, eliminating the thickness contribution of separate connectors and interfaces. This integration reduces the overall module thickness while the bonding process maintains assembly flexibility through standardized manufacturing techniques.
3Ease of manufacture
If multiple board-to-board connectors are used to connect the charging coil, then manufacturing and assembly flexibility are improved, but the structural complexity and cost increase
Solution Approach 1:
The patent eliminates multiple board-to-board connectors by integrating the charging coil and circuit board into a single structure. This reduction in connector quantity simplifies the overall device structure and reduces cost while maintaining manufacturing flexibility through standardized integration processes.
4Ease of manufacture
If the charging coil and circuit board are stacked separately, then manufacturing is simplified, but the overlapping region increases the module thickness
Solution Approach 1:
The charging coil substrate and circuit board substrate are bonded together to form an integrated structure, eliminating the need for separate stacking. This integration removes the additional thickness that would result from stacking separate components while maintaining manufacturing simplicity through standardized bonding processes.
Data Source
AI summary
A substrate of a circuit board and a substrate of a charging coil are disposed at a same layer, a first wiring layer and a first coil are disposed at a same layer, and a second wiring layer and a second coil are disposed at a same layer, so that the charging coil and the circuit board form an integrated structure. The first coil and the second coil may be directly electrically connected to a wire on the circuit board, for example, a wire at the first wiring layer of the circuit board or a wire at the second wiring layer of the circuit board. This can shorten a charging path between the charging coil and a load, to reduce a link loss. In addition, a BTB connector can be omitted, to simplify a structure of a charging coil module, and reduce costs of the charging coil module.