Integrated Chiller with Dual Flow Channels for Semiconductor Wafer Temperature Control
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Solution Overview
Problem
The existing semiconductor manufacturing apparatuses require a large installation area due to the need for multiple chillers to regulate wafer temperature accurately, which increases the space requirements for plasma processing and other temperature-controlled processes.
Innovation Solution
A semiconductor manufacturing apparatus that utilizes a combination of a chiller and a heater to regulate the temperature of a fluid, with separate flow channels and a flow rate regulator to mix and control the coolant water temperature between the chiller's cooling and the heater's heating settings, reducing the need for multiple chillers and minimizing installation space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple chillers are used to regulate wafer temperature quickly and accurately, then temperature control precision is improved, but installation area increases
Solution Approach 1:
The patent combines multiple chillers into a single chiller by integrating multiple temperature regulation functions. The single chiller includes multiple cooling circuits that can independently regulate temperature, replacing the need for multiple separate chillers and reducing installation area while maintaining temperature control precision.
Solution Approach 2:
The single chiller is designed with multi-functionality to perform temperature regulation for multiple flow channels simultaneously. It includes multiple compressors, condensers, and expansion valves that can independently control different cooling circuits, allowing one chiller to replace multiple chillers' functions.
2Speed
If multiple chillers are installed to achieve quick temperature regulation, then temperature regulation speed is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple chiller units into a single integrated chiller system. The unified control unit coordinates multiple cooling circuits within one chiller, reducing device complexity by eliminating redundant components and control systems while maintaining quick temperature regulation capability.
Solution Approach 2:
The chiller system incorporates dynamic control mechanisms with multiple compressors that can operate independently or in combination. The control unit dynamically adjusts the operation of individual compressors and cooling circuits based on real-time temperature requirements, enabling quick temperature regulation without increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise temperature control of the coolant water within a smaller installation area, reducing the overall space required for the apparatus while maintaining quick and accurate temperature regulation, thus optimizing the use of space in semiconductor manufacturing.
Implementation Method 1
a chiller configured to cool the coolant water
Implementation Method 2
a heater configured to heat the coolant water
Implementation Method 3
a flow rate regulator configured to regulate a flow rate of the coolant water in the first flow channel and a flow rate of the coolant water in the second flow channel
Implementation Method 4
a fluid supply channel configured to join the coolant water in the first flow channel and the coolant water in the second flow channel
Data Source
AI summary
In one embodiment, a semiconductor manufacturing apparatus includes a housing configured to house a substrate, and a first temperature regulator configured to regulate a temperature of a fluid. The apparatus further includes first and second flow channels configured to divide the fluid supplied from the first temperature regulator, and a second temperature regulator configured to regulate a temperature of the fluid in the second channel. The apparatus further includes a fluid supply channel configured to join the fluid in the first flow channel and the fluid in the second flow channel and to supply the joined fluids to the housing, and a flow rate regulator configured to regulate a flow rate of the fluid in the first flow channel and a flow rate of the fluid in the second flow channel.