Integrated Liquid Cooling Cabinet for Chip and Memory Cooling
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Solution Overview
Problem
Current liquid cooling systems for data center servers require multiple cooling devices, leading to mismatched working substances, complex assembly, high energy consumption, and increased environmental cooling load, while failing to maintain consistent inlet and outlet temperatures.
Innovation Solution
A high-efficiency liquid cooling cabinet with integrated air and water cooling systems, featuring adjustable air intake, wind direction control, and direct coolant circulation to chips and memory strips, ensuring uniform temperature distribution and reduced environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple cooling devices (chip radiator, memory backplane radiator, room air conditioner) are arranged to cool chips and memory separately, then cooling effectiveness is improved, but device complexity and energy consumption increase
Solution Approach 1:
The patent merges the chip cooling radiator and memory backplane radiator into a single integrated cooling system. The cooling plate is designed with multiple cooling holes that simultaneously serve both chips and memory, eliminating the need for separate cooling devices and reducing system complexity while maintaining cooling effectiveness.
Solution Approach 2:
The cooling plate is designed as a multi-functional component that performs both chip cooling and memory cooling simultaneously. The cooling holes in the cooling plate serve dual purposes: cooling chips directly and cooling memory through the backplane, making the cooling system universal and efficient.
2Adaptability or versatility
If multiple cooling devices with different working substances are used, then cooling coverage is improved, but system complexity and cost increase
Solution Approach 1:
The patent combines chip cooling and memory cooling into a single working substance circulation system. The cooling plate with multiple cooling holes allows one working substance to serve both cooling needs, eliminating the complexity of managing multiple working substances and their corresponding circulation pipelines.
3Reliability
If cold air is blown through memory to cool it, then memory cooling is achieved, but wind temperature rises and increases environmental cooling load
Solution Approach 1:
The patent introduces a cooling plate as an intermediary component between the cooling source and memory. The cooling plate with cooling holes provides a controlled cooling path for memory, preventing direct cold air contact that causes temperature rise and environmental heat dissipation, thus reducing the environmental cooling load.
4Reliability
If direct contact liquid cooling is used for chips, then cooling efficiency is improved, but implementation difficulty and requirements increase
Solution Approach 1:
The patent uses a cooling plate as an intermediary component that facilitates indirect contact cooling for chips. The cooling plate with cooling holes provides a practical implementation of liquid cooling without requiring direct contact between coolant and chips, reducing implementation difficulty while maintaining cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simultaneously cools chips and memory strips efficiently with consistent inlet and outlet temperatures, reducing energy consumption and environmental cooling load by integrating air and liquid cooling technologies.
Implementation Method 1
the heat dissipation of the chip is achieved by attaching a liquid cooling radiator to the CPU
Implementation Method 2
the coolant in the radiator comes from an external cold source
Implementation Method 3
memory cooling is achieved by blowing cold air through the memory through the fan arranged on the substrate
Implementation Method 4
a water cooling device, the water cooling device includes U-shaped pipes, a horizontal pipe, a straight pipe, L-shaped pipes
Implementation Method 5
the coolant enhances the convective heat transfer to cool the bottom chips
Data Source
AI summary
A new type of high-efficiency liquid cooling cabinet for a data center server is provided. A new type of high-efficiency liquid cooling cabinet for a data center server includes a base plate, a cabinet, main boards, and memory strips, etc.; and the cabinet is welded on the upper part of the base plate, the front, left and right sides of the cabinet are open settings, seven main boards are evenly distributed up and down in the cabinet. By connecting the water inlet pipe from the outdoor to the coolant, the coolant enhances the convective heat transfer to cool the bottom chips, and the hot wind in the holes is cooled by the coolant flowing through the cavity of the six-hole heat-dissipation cavity device, finally, it is ensured that the main board and the memory strips may be cooled below the safe temperature simultaneously.