Integrated Circuit Board Cooling for Semiconductor Heat Transfer
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Solution Overview
Problem
The existing semiconductor devices with liquid cooling members face inefficiencies in heat transfer due to multiple layers between the semiconductor element and the refrigerant, leading to reduced cooling efficiency.
Innovation Solution
A semiconductor device design featuring conductive members joined to the semiconductor element, sealed with resin, and incorporating refrigerant passages or pipes within these members to enhance heat transfer, reducing the number of layers between the semiconductor element and the refrigerant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a liquid cooling member is fixed to a base plate with multiple layers (semiconductor element, circuit board, base plate, cooling member), then the device structure is stable and easy to manufacture, but the heat transfer efficiency deteriorates due to multiple layers between the semiconductor element and refrigerant
Solution Approach 1:
The patent merges the circuit board and cooling member into a single integrated structure where the circuit board serves dual functions as both electrical connection medium and heat dissipation component. The refrigerant passages are formed within the circuit board itself, eliminating the need for a separate base plate cooling member and reducing the number of layers between the semiconductor element and refrigerant.
Solution Approach 2:
The circuit board is designed to perform multiple functions simultaneously: electrical connection, structural support, and heat dissipation. By incorporating refrigerant passages directly into the circuit board, it becomes a multi-functional component that eliminates the need for dedicated cooling members, thereby improving heat transfer efficiency while maintaining manufacturing simplicity.
2Reliability
If multiple layers are used between semiconductor element and refrigerant, then device stability is improved, but cooling efficiency deteriorates
Solution Approach 1:
The circuit board and cooling member are merged into a single integrated structure, reducing the number of interfaces and layers between the semiconductor element and refrigerant. This integration maintains structural stability while improving thermal coupling and cooling efficiency.
3Ease of manufacture
If conventional multi-layer structure is used, then ease of manufacture is maintained, but device size increases
Solution Approach 1:
The circuit board and cooling member are merged into a single integrated structure, reducing the overall device volume by eliminating redundant components and layers. The refrigerant passages are formed directly within the circuit board, which maintains manufacturing simplicity while achieving compact dimensions.
Solution Approach 2:
The refrigerant passages are nested within the circuit board structure, allowing the cooling function to be embedded within the existing circuit board volume without adding external cooling components. This nesting approach reduces device size while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency by directly transferring heat from the semiconductor element to the refrigerant, stabilizing operation, prolonging device life, and enhancing power efficiency while downsizing the device.
Implementation Method 1
a cooling unit that cools the conductive member inside the resin... directly transferring heat from the semiconductor element to the refrigerant
Data Source
AI summary
A semiconductor device includes a semiconductor element, a conductive member, a resin, and a cooling unit. The conductive member is joined to the semiconductor element. The resin seals a part of the semiconductor element and the conductive member. The cooling unit cools the conductive member inside the resin.