Integrated Circuit Boards in Composite Preforms for Ice Protection

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Solution Overview

Problem

Aircraft engine components with complex profiles require heating systems that span multiple zones, making dedicated heating systems impractical and costly for preventing or removing ice formation under adverse weather conditions.

Innovation Solution

A method involving preform modules made of organic matrix composite material, where electrical circuits are applied and molded together to form a one-piece component, allowing for integrated heating circuits and power transfer without traditional wiring, enabling efficient and cost-effective ice protection and power distribution in complex geometries.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If dedicated heating systems are used for each individual component, then ice protection is provided for simple components, but the system becomes impractical and costly for complex parts requiring multiple heating zones

Engineering Contradiction:
Improveice protection capabilityVSAvoidheating system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate heating circuits into a single integrated circuit board that spans multiple components. Instead of using dedicated heating systems for each component, the invention combines heating zones for complex parts into one unified circuit board that can be applied across multiple components simultaneously, reducing overall system complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit board serves multiple functions: it provides heating across multiple components, acts as a structural element, and eliminates the need for separate connectors and wiring for each component. This multi-functional approach resolves the contradiction by providing comprehensive ice protection while reducing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple separate components with individual heating elements are assembled, then each component can be independently heated, but the assembly requires multiple connectors and wiring increasing complexity

Engineering Contradiction:
Improveindependent heating controlVSAvoidconnector and wiring complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple circuit boards into one integrated circuit board that spans multiple components. This merging eliminates the need for multiple connectors and wiring between components, as the integrated board provides continuous electrical connectivity across all heated zones while maintaining the ability to control different heating zones independently.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If traditional wiring and connectors are used to connect heating circuits across components, then electrical connectivity is achieved, but the system becomes costly and complex

Engineering Contradiction:
Improveelectrical connectivityVSAvoidmanufacturing cost and complexity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical wiring and connector system with an integrated circuit board that provides electrical connectivity through its structural design. Instead of using traditional mechanical connections (wires and connectors), the invention uses a monolithic circuit board that spans multiple components, eliminating the need for secondary bonding and reducing manufacturing complexity and cost.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

4Reliability

If dedicated heating systems are applied to each component, then simple components can be protected from ice, but complex parts requiring multiple zones become impractical

Engineering Contradiction:
Improveice protection coverageVSAvoidsystem implementation efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges heating coverage across multiple components into a single integrated circuit board. This allows complex parts requiring multiple heating zones to be protected efficiently, as the integrated board can be applied in fewer steps compared to installing separate heating elements on each component, thereby improving productivity and system implementation efficiency.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for compact, cost-effective integration of multiple heating zones and power transfer within aircraft engine components, reducing the need for secondary bonding and connectors, while optimizing aerodynamics and reducing controller complexity.

Implementation Method 1

the electrical circuits include electrical traces or heater traces, and the arranging step includes placing traces on the first preform module in direct contact with traces on the second preform module

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

the electrical circuits include electrical traces or heater traces

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentEP3071814B1Method to integrate multiple electric circuits into organic matrix composite
Publication Date: 2021.05.05 RTX CORP
  • EP3071814B1 patent drawingFigure 1
  • EP3071814B1 patent drawingFigure 2~4
  • EP3071814B1 patent drawingFigure 5~7

AI summary

A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.