Integrated Circuit Layout With Differential Gate Pitch Transistors

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Solution Overview

Problem

The miniaturization of integrated circuits poses challenges in design and manufacturing, requiring stricter specifications and affecting reliability, while existing EDA tools struggle to optimize layouts effectively.

Innovation Solution

The integration of transistors with varying gate pitches and active region configurations, such as FinFETs, nanosheet, and nanowire transistors, allows for improved electrical characteristics and flexibility in design, enhancing performance through differential pitches and layouts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If transistors are miniaturized to reduce device size and power consumption, then device functionality and integration density are improved, but manufacturing precision and reliability become more difficult to maintain

Engineering Contradiction:
Improvedevice sizeVSAvoidmanufacturing precision
Core Design Contradiction:
Area of moving objectVSManufacturing precision

Solution Approach 1:

The patent applies different gate pitches to different transistors within the same integrated circuit. Specifically, first transistors have a first gate pitch while second transistors have a second gate pitch that is different from the first. This local variation in geometric parameters allows optimization of electrical characteristics for different circuit functions while maintaining overall miniaturization benefits.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the geometric parameter of gate pitch to optimize transistor performance. By varying the gate pitch between different transistor types (first transistors with first gate pitch, second transistors with second gate pitch), the patent achieves improved electrical characteristics such as intrinsic gain, reduced parasitic capacitance, and optimized noise figure without requiring uniform miniaturization across all devices.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If transistors are miniaturized to increase integration density, then more functionality is achieved in smaller area, but design and manufacturing specifications become stricter

Engineering Contradiction:
Improveintegration densityVSAvoiddesign specification
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Different gate pitches are assigned to different transistors based on their functional requirements. First transistors use a first gate pitch optimized for their specific function, while second transistors use a second gate pitch optimized for their different function. This localized optimization allows high integration density while avoiding uniform strict specifications across all devices.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The integrated circuit is segmented into different regions with different transistor types and gate pitches. The circuit includes both first transistors with first gate pitch and second transistors with second gate pitch, allowing different design specifications for different segments based on their specific performance requirements.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If uniform gate pitch is used across all transistors, then manufacturing is simplified, but electrical characteristics such as intrinsic gain and parasitic capacitance cannot be optimized

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidelectrical characteristic
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent implements local quality by assigning different gate pitches to different transistors based on their specific electrical characteristic requirements. First transistors have a first gate pitch optimized for their electrical characteristics, while second transistors have a second gate pitch optimized for their different electrical characteristics, achieving both manufacturing feasibility and electrical performance optimization.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The gate pitch parameter is varied between different transistor types to optimize electrical characteristics. The first gate pitch and second gate pitch are different, allowing optimization of intrinsic gain, parasitic capacitance, and noise figure for different transistor functions while maintaining a relatively simple manufacturing process.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20260068324A1Integrated circuit and method of forming the same
Publication Date: 2026.03.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20260068324A1 patent drawing
  • US20260068324A1 patent drawing
  • US20260068324A1 patent drawing

AI summary

An integrated circuit includes a first set of active regions and a first and second set of gates. The first set of active regions extends in a first direction, and is on a first level. The first set of active regions corresponds to a first transistor. The second set of gates extends in a second direction, are on a second level, and overlaps the first set of active regions. The first set of gates corresponds to the first transistor. Each gate of the first set of gates is separated from an adjacent gate of the second set of gates in the second direction by a first pitch. Each gate of the second set of gates is separated from an adjacent gate of the second set of gates in the second direction by a second pitch different from the first pitch.