Integrated Circuit Package With Grating-Coupler Optical Routing
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more creative packaging techniques for semiconductor dies to accommodate the demand for shrinking electronic devices, particularly in integrating optical integrated circuit dies with reduced optical loss and compact form factors.
Innovation Solution
The integration of optical integrated circuit dies with grating couplers, lens adapters, and mirrors in specific configurations allows for high bandwidth and ultra-low power consumption, utilizing lateral entry optical fibers and reducing optical loss, suitable for various packaging configurations such as multi-chip modules, chip-on-wafer-on-substrate packages, or integrated fan-out packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging techniques are used for semiconductor dies, then manufacturing simplicity is maintained, but the package size cannot be reduced and integration density is limited
Solution Approach 1:
The packaging structure is divided into multiple functional layers including substrate, underfill material, semiconductor dies with grating couplers, lens adapters, and mirrors. Each layer performs a specific function, allowing the overall package volume to be reduced while maintaining manufacturing feasibility through modular assembly
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional vertical stacking, where optical components (grating couplers, lenses, mirrors) are arranged in vertical layers. This dimensional change enables higher integration density and smaller package footprint without proportionally increasing manufacturing complexity
2Productivity
If optical integrated circuit dies are integrated with grating couplers and lenses, then optical bandwidth is improved, but optical loss increases
Solution Approach 1:
Lens adapters are introduced as intermediary components between the grating couplers on the semiconductor dies and the optical fibers. These lens adapters focus and guide the optical signals, reducing divergence and insertion loss while maintaining the high bandwidth capability enabled by the grating coupler architecture
Solution Approach 2:
The patent optimizes optical parameters including the numerical aperture, focal length, and curvature radius of the lens adapters to match the grating coupler characteristics. By carefully controlling these optical parameters, the system achieves low optical loss while maintaining high bandwidth transmission
3Volume of moving object
If compact packaging configurations are implemented, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The underfill material is applied in advance to the substrate before mounting the semiconductor dies. This preliminary action creates a stable mechanical foundation and stress distribution layer that facilitates subsequent precise alignment of optical components during die attachment, enabling compact packaging without excessive precision requirements
Solution Approach 2:
The grating couplers and lens adapters are designed with self-aligning features where the optical components naturally position themselves during the bonding process. The optical interfaces are configured to provide mechanical registration, reducing the need for high-precision external alignment equipment and processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves compact and efficient packaging with reduced optical loss, enabling high bandwidth and low power consumption, making it suitable for diverse packaging applications.
Implementation Method 1
The optical die includes a grating coupler
Implementation Method 2
lens adapters, and mirrors in specific configurations allows for high bandwidth and ultra-low power consumption
Implementation Method 3
lens adapters, and mirrors in specific configurations allows for high bandwidth and ultra-low power consumption
Data Source
AI summary
An embodiment is a package including a package substrate and a package component bonded to the package substrate, the package component including an interposer, an optical die bonded to the interposer, the optical die including an optical coupler, an integrated circuit die bonded to the interposer adjacent the optical die, a lens adapter adhered to the optical die with a first optical glue, a mirror adhered to the lens adapter with a second optical glue, the mirror being aligned with the optical coupler of the optical die, and an optical fiber on the lens adapter, a first end of the optical fiber facing the mirror, the optical fiber being configured such than an optical data path extends from the first end of the optical fiber through the mirror, the second optical glue, the lens adapter, and the first optical glue to the optical coupler of the optical die.