Integrated Circuit Wire Patterns With Integral Plug Portions
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Solution Overview
Problem
Conventional integrated circuit manufacturing processes face challenges in electrically connecting integrated circuit wires across different levels of metallization, relying on connection holes and semiconductor deposition techniques which are complex and not easily adaptable.
Innovation Solution
The integration of a conductive plug wire pattern with a recessed portion and an integral plug portion in a trench, along with a plug spacer layer, allows for direct electrical connections between conductive wire patterns on different levels of metallization, simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection holes and vias are used to electrically connect integrated circuit wires on different levels, then electrical connectivity is achieved, but the manufacturing process complexity increases due to additional semiconductor deposition, photolithography, and etching techniques
Solution Approach 1:
The patent merges the wire structure and connection function into a single integrated component. The conductive plug wire pattern includes both the horizontal wire portion and the vertical plug portion that extends into the connection hole, eliminating the need for separate via formation processes. This integration reduces manufacturing steps while maintaining reliable electrical connectivity between different metallization levels.
Solution Approach 2:
The conductive plug wire pattern is segmented into distinct functional portions: a wire portion for horizontal connectivity and a plug portion for vertical connection. This segmentation allows each portion to be optimized for its specific function while being formed as a single integrated structure, simplifying the overall manufacturing process.
2Reliability
If conventional connection holes are used for inter-level wiring, then electrical connection is established, but the process is not easily adaptable to different design requirements
Solution Approach 1:
The conductive plug wire pattern serves multiple functions: it acts as both a wire for horizontal signal transmission and a plug for vertical connection to lower levels. This multi-functionality makes the structure adaptable to various design requirements and eliminates the need for separate via structures, enhancing process versatility.
3Device complexity
If integral plug portions are integrated into wire patterns, then manufacturing complexity is reduced, but precise formation of recessed portions and plug portions requires advanced fabrication techniques
Solution Approach 1:
The conductive layer is formed to extend beyond the trench boundaries before the trench is etched. This preliminary extension allows the subsequent trench formation process to automatically define the recessed portion and plug portion boundaries, achieving precise geometry through the sequence of operations rather than requiring complex direct patterning of the final structure.
Data Source
AI summary
An integrated circuit device includes a substrate including a trench therein and a conductive plug wire pattern in the trench. The conductive plug wire pattern includes a recessed portion that exposes portions of opposing sidewalls of the trench, and an integral plug portion that protrudes from a surface of the recessed portion to provide an electrical connection to at least one other conductive wire pattern on a different level of metallization. A surface of the plug portion may protrude to a substantially same level as a surface of the substrate adjacent to and outside the trench, and the surface of the recessed portion may be below the surface of the substrate outside the trench. Related fabrication methods are also discussed.