Integrated Clip Fastening for Uniform Semiconductor Package Cooling

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Solution Overview

Problem

Existing methods for mounting semiconductor packages to heatsinks result in inhomogeneous mounting pressure distribution, leading to suboptimal thermal resistance and heat dissipation, particularly around the semiconductor die.

Innovation Solution

The integration of a clip with a fastening element that applies consistent pressure across the semiconductor package, ensuring uniform heat dissipation by connecting it securely to an external heatsink, utilizing a clip design that can be partially or fully embedded within the encapsulant to enhance thermal conductivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If screws or clips are used to mount the semiconductor package to the heatsink, then the package can be securely retained, but the mounting pressure distribution becomes inhomogeneous

Engineering Contradiction:

Improvemounting securityVSAvoidmounting pressure distribution

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The mounting system is segmented into multiple independent contact points (screws at corners, clip at center) that can be optimized separately. The clip is divided into multiple arms that contact the package at different locations, allowing each segment to contribute to overall pressure distribution without creating localized stress concentrations.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different mounting elements are applied at different locations on the package with different functions. The clip contacts the package at the center region above the semiconductor die to provide uniform pressure, while screws are positioned at corner mounting holes for secure retention. This local differentiation optimizes pressure distribution where it matters most (above the die) while maintaining overall mounting security.

Inventive Principle:

Principle #3Local quality

2Reliability

If mounting pressure is increased around the package mounting hole, then secure retention is achieved, but thermal resistance increases in the region above the semiconductor die

Engineering Contradiction:

Improvemounting securityVSAvoidthermal resistance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The mounting system applies pressure locally at different locations with different intensities and purposes. The clip concentrates pressure above the semiconductor die region where thermal contact is critical, while screws provide distributed pressure at mounting holes for security. This local optimization ensures high pressure where thermal performance matters most without compromising mounting security.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The clip acts as an intermediary element between the package and heatsink, mediating the pressure distribution. It transfers and distributes the fastening force from the screw-clip connection to multiple contact points on the package, creating a pressure distribution pattern that prioritizes thermal contact above the die while maintaining overall mounting security.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If a clip is used for mounting, then simplified assembly is achieved, but the pressure range is limited

Engineering Contradiction:

Improveassembly simplicityVSAvoidpressure range

Core Design Contradiction:

Ease of manufactureVSStress or pressure

Solution Approach 1:

The system merges the advantages of both clips and screws by combining a clip mechanism with a screw fastening element. The clip provides simplified assembly and flexible pressure adjustment, while the screw provides secure retention and extended pressure range. This combination maintains the ease of manufacture associated with clips while overcoming their limited pressure range through the addition of the screw fastening element.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces thermal resistance and enhances heat dissipation by maintaining consistent pressure, improving the overall thermal performance of the electronic module.

Implementation Method 1

a clip (52) connected to the semiconductor package (51) and comprising at least one fastening element (53) which is configured to make a connection to an external heatsink (54)

Methodology Applied

Scientific EffectMechanical pressure: Mechanical Force

Implementation Method 2

The packages are in general isolated from the heatsink with an elastic insulation layer in form of a foil or an insulation layer integrated into the package. The thermal throughput of such insulation layers highly depends on the mounting pressure

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

an elastic insulation layer in form of a foil

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentEP4170708B1An electronic module comprising a semiconductor package with integrated clip and fastening element

Publication Date: 2025.12.31 INFINEON TECH AUSTRIA AG

Figure 1A~1B
Figure 2A~2B
Figure 3~4

AI summary

An electronic module (90B) comprises a semiconductor package (91), and a clip (92B) connected to the semiconductor package (91) and connected to or comprising at least one fastening element (92B.1) which is configured to make a connection to an external heatsink (94), wherein the fastening element (92B.1) is formed integral with the clip (92B).