Integrated Clock and Power Distribution Network
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Solution Overview
Problem
The performance of semiconductor devices is hindered by poor distribution of power and clock signals, leading to reduced frequency and increased power dissipation due to mismatched devices and wires, with wire propagation delay accounting for half of the total clock distribution delay.
Innovation Solution
An integrated clock and power distribution network is created using a full-dense-mesh configuration on top metal layers with a low impedance underpass on the next metal layer, employing an orthogonal placement grid and bow tie elements to minimize delay and skew, and integrate clock and power distribution structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate clock and power distribution networks are used, then design flexibility is maintained, but area overhead increases and performance is degraded
Solution Approach 1:
The patent merges the clock distribution network and power distribution network into a single integrated structure where clock signals and power signals share the same distribution pathways and routing infrastructure, eliminating the need for separate networks and reducing overall complexity while improving performance
2Loss of time
If conventional clock distribution is used, then implementation is simple, but wire propagation delay accounts for half of total clock distribution delay
Solution Approach 1:
The patent transitions from traditional two-dimensional planar clock distribution to a three-dimensional vertical distribution architecture utilizing multiple metal layers, where clock signals propagate through stacked conductive layers to reduce horizontal wire lengths and propagation delays
3Productivity
If top metal layers are used for distribution, then wire resources are optimized, but power distribution quality may be compromised
Solution Approach 1:
The patent employs a composite distribution structure combining multiple metal layers with different electrical characteristics, where top metal layers optimized for signal distribution work in conjunction with lower metal layers optimized for power delivery, creating a hybrid network that achieves both wire resource efficiency and power distribution quality
Data Source
AI summary
An integrated clock and power distribution network in a semiconductor device includes assigning a first tile to a location on a placement grid corresponding to a top metal layer. An orientation is assigned to the first tile relative to the top metal layer placement grid. The first tile is placed on a representation corresponding to the top metal layer in accordance with the assignments. A second tile is assigned to a location on a placement grid corresponding to a top-1 metal layer. The orientation is assigned to the second tile relative to the top-1 metal layer placement grid. The second tile is placed on a representation corresponding to the top-1 metal layer in accordance with the assignments. The first and second tile are arranged as a full-dense-mesh distribution structure. The first tile includes an integrated clock and power distribution structure. The second tile includes a low impedance underpass structure.