Integrated CMUT and PMUT Semiconductor Architecture for Compact Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor devices typically consist of MEMS devices of the same type, leading to increased manufacturing costs, larger packaging sizes, and higher power consumption.

Innovation Solution

Integration of different types of MEMS devices, such as CMUT and PMUT, within a single semiconductor device, where each type has a distinct functional structure with a different chemical composition, allowing them to respond to different stimuli, thereby reducing manufacturing costs, packaging sizes, and power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple separate semiconductor devices are used to provide different MEMS functions, then each device can be optimized for its specific function, but the overall packaging size, manufacturing cost, and power consumption increase

Engineering Contradiction:

Improvefunctional diversityVSAvoidpackaging size

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple different MEMS device types (e.g., capacitive micromachined ultrasonic transducers and piezoelectric micromachined ultrasonic transducers) into a single semiconductor device structure. Different MEMS devices are formed in different wells within the same semiconductor substrate, sharing common support structures, interconnect layers, and packaging, thereby reducing overall packaging size while maintaining functional diversity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The semiconductor device structure is designed to support multiple types of MEMS devices with different functional structures (e.g., first functional structure for CMUT, second functional structure for PMUT) within a single integrated platform. The device includes universal components such as shared dielectric structures, interconnect structures, and support substrates that accommodate various MEMS device types

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If multiple separate semiconductor devices are manufactured independently, then each device can be optimized for its specific manufacturing process, but the overall manufacturing cost increases

Engineering Contradiction:

Improvefunctional diversityVSAvoidmanufacturing cost

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Multiple different MEMS devices are manufactured simultaneously in the same semiconductor fabrication process using a single substrate. The process includes forming different functional structures in different wells using shared manufacturing steps such as deposition, etching, and doping, thereby reducing per-device manufacturing cost while achieving functional diversity

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

While using a unified manufacturing process, the patent allows different local regions (wells) to have different functional structures optimized for specific MEMS device types. Each well can be selectively processed with appropriate materials and structures (e.g., first dielectric structure for CMUT, second dielectric structure for PMUT) while sharing the overall fabrication workflow

Inventive Principle:

Principle #3Local quality

3Adaptability or versatility

If multiple separate semiconductor devices are used to provide different MEMS functions, then each device can operate independently, but the overall power consumption increases

Engineering Contradiction:

Improvefunctional diversityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by stationary object

Solution Approach 1:

Multiple different MEMS devices are integrated into a single semiconductor device with shared support structures, interconnect layers, and packaging. This integration reduces the total power consumption by eliminating redundant support systems and enabling coordinated operation of different MEMS device types (e.g., using CMUT for receiving and PMUT for transmitting in an ultrasonic sensor array)

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integration of diverse MEMS devices in a single semiconductor device reduces manufacturing costs, minimizes packaging sizes, and lowers power consumption while maintaining functionality.

Implementation Method 1

The first functional structure comprises a first material having a first chemical composition, and the second functional structure comprises a second material having a second chemical composition that is different than the first chemical composition

Methodology Applied

Scientific EffectChemical composition differentiation:

Data Source

PatentUS20250250163A1A semiconductor device comprising different types of microelectromechanical systems devices

Publication Date: 2025.08.07 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first movable element over a first substrate. A second movable element overlies the first substrate. A first functional layer is on the first movable element. The first functional layer comprises a first material different from a material of the first movable element. A second functional layer is on the second movable element.