Integrated Coaxial RF Substrate for Lower-Cost Board Interconnects
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Solution Overview
Problem
Conventional radio-frequency arrangements for mobile communication systems, such as those using coaxial cables and terminals, incur high manufacturing costs due to the expense of coaxial elements and connections, which are not cost-effective compared to modern systems-in-package technologies.
Innovation Solution
A radio-frequency arrangement that connects a baseband board and an antenna board via a coaxial radio-frequency line integrated into a wiring substrate, utilizing an internal conductor for signal transmission and an external conductor for shielding, which are insulated from each other, allowing for a more cost-effective connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional coaxial cables and terminals are used to connect radio-frequency components, then reliable electrical connection is achieved, but manufacturing costs increase significantly
Solution Approach 1:
The patent merges the coaxial cable function directly into the wiring substrate by forming coaxial radio-frequency lines within the substrate layers. The internal conductor, external conductor, and insulation are integrated into a single substrate structure, eliminating the need for separate coaxial cables and terminals while maintaining reliable electrical connection and reducing manufacturing cost.
Solution Approach 2:
The wiring substrate acts as an intermediary element that provides both mechanical support and electrical connection functions. By forming coaxial lines within the substrate, it mediates between the radio-frequency components and the connection requirements, replacing expensive external coaxial cables while ensuring reliable signal transmission.
2Reliability
If expensive coaxial elements and terminals are used for connection, then reliable signal transmission is ensured, but cost-effectiveness decreases compared to modern systems-in-package technologies
Solution Approach 1:
The patent combines multiple functions (signal transmission, shielding, mechanical support) into a single integrated wiring substrate structure. The coaxial lines are formed directly within the substrate layers using standard PCB manufacturing techniques, achieving reliable signal transmission at costs comparable to modern systems-in-package technologies.
Solution Approach 2:
The patent changes the physical parameters of the connection system by transitioning from external coaxial cables to integrated substrate traces. By controlling the geometry, materials, and layer structure of the substrate, it maintains the electrical characteristics needed for reliable signal transmission while dramatically reducing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs by replacing conventional coaxial connections with an integrated coaxial radio-frequency line in the wiring substrate, enabling efficient and cost-effective electrical connections between radio-frequency components, facilitating mass production of multi-functional radio-frequency modules.
Implementation Method 1
a coaxial radio-frequency line formed in the wiring substrate, wherein the first radio-frequency component and the second radio-frequency component are connected via the coaxial radio-frequency line
Implementation Method 2
the coaxial radio-frequency line comprises at least one internal conductor and at least one external conductor for radio-frequency shielding the at least one internal conductor
Implementation Method 3
the at least one external conductor and the at least one internal conductor being insulated from each other
Data Source
AI summary
A radio-frequency arrangement is described. The radio-frequency arrangement has a first radio-frequency component, a second radio-frequency component and a wiring substrate having a coaxial radio-frequency line formed in the wiring substrate, wherein the first radio-frequency component and the second radio-frequency component are connected via the coaxial radio-frequency line.