Integrated Coil Module Reducing Mutual Inductance
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Solution Overview
Problem
The integration of coils with different inductances in independent circuits increases system cost and complexity, as well as volume, due to the need for multiple coils, which complicates the layout.
Innovation Solution
An electronic module is designed with coils of varying inductances integrated onto a substrate, where each coil is encapsulated by a molding body with a non-magnetic gap between them, using a magnetic material and conductive layers, allowing for separate electrical connections and reducing mutual inductance interactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple coils with different inductances are used in different independent circuits, then the electrical performance and circuit functionality are improved, but the system volume, cost, and layout complexity increase
Solution Approach 1:
The patent combines multiple coils with different inductances into a single integrated module on one substrate. The module includes a first coil and a second coil with different inductance values, both mounted on the same substrate and encapsulated together, thereby reducing the overall system volume while maintaining the functionality of multiple independent circuits
Solution Approach 2:
The integrated coil module serves multiple circuit functions simultaneously. By incorporating coils with different inductances in a single module, the design enables multiple independent circuits to be implemented with a unified structure, reducing both volume and the number of separate components required
2Adaptability or versatility
If multiple coils with different inductances are used in different independent circuits, then the electrical performance and circuit functionality are improved, but the system cost increases
Solution Approach 1:
The patent combines multiple coils with different inductances into a single integrated module on one substrate. The module includes a first coil and a second coil with different inductance values, both mounted on the same substrate and encapsulated together, thereby reducing the overall system volume while maintaining the functionality of multiple independent circuits
Solution Approach 2:
The integrated coil module serves multiple circuit functions simultaneously. By incorporating coils with different inductances in a single module, the design enables multiple independent circuits to be implemented with a unified structure, reducing both volume and the number of separate components required
3Adaptability or versatility
If multiple coils with different inductances are used in different independent circuits, then the electrical performance and circuit functionality are improved, but the layout complexity increases
Solution Approach 1:
The patent combines multiple coils with different inductances into a single integrated module on one substrate. The module includes a first coil and a second coil with different inductance values, both mounted on the same substrate and encapsulated together, thereby reducing the overall system volume while maintaining the functionality of multiple independent circuits
Solution Approach 2:
The patent introduces a shielding layer between the first coil and the second coil to reduce magnetic coupling and interference. This intermediary shielding structure simplifies the layout design by providing isolation between adjacent coils, thereby reducing layout complexity while maintaining circuit functionality
4Volume of stationary object
If coils are placed close together to reduce volume, then the system volume is reduced, but mutual inductance interference increases
Solution Approach 1:
The patent introduces a shielding layer between the first coil and the second coil to reduce magnetic coupling and interference. This intermediary shielding structure simplifies the layout design by providing isolation between adjacent coils, thereby reducing layout complexity while maintaining circuit functionality
Solution Approach 2:
The patent extracts the harmful magnetic coupling effect by introducing a shielding layer that blocks or redirects magnetic flux between adjacent coils. This allows the coils to be placed closer together for volume reduction while the shielding layer removes the harmful mutual inductance interference
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the system's volume and complexity by integrating multiple inductors with different inductances into a single module, improving design flexibility and electrical performance by minimizing coil interactions and optimizing circuit routing.
Implementation Method 1
The molding body comprises a magnetic material. The molding body comprises a magnetic material that extends into the hollow space of each coil. a magnetic core is disposed inside the hollow space of each coil
Implementation Method 2
a non-magnetic material is disposed in said gap
Data Source
AI summary
The present invention discloses an electronic module. The electronic module comprises: a substrate, having a top surface and a bottom surface; a plurality of coils on the top surface of the substrate, wherein each coil comprises a corresponding first end and a corresponding second end; and a molding body, disposed on the substrate to encapsulate said coils, wherein said corresponding first end and said corresponding second end of each coil are electrically coupled to a corresponding first electrode and a corresponding second electrode of the electronic module.