Integrated Cold Plate Assembly for Compact Signal and Power Routing

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Solution Overview

Problem

Existing electronic devices face challenges with large cable occupancy and complex maintenance due to the use of cables for signal transmission and power supply between modules or boards, which hinders space efficiency and integration.

Innovation Solution

A cold plate assembly integrating a flexible printed circuit with high-speed signal and power interconnection cables, providing heat dissipation, signal transmission, and power supply functions, reducing the need for separate cables and enhancing integration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If cables are used for signal transmission and power supply between modules or boards, then signal transmission and power supply functions are achieved, but cable occupancy space increases and maintenance complexity increases

Engineering Contradiction:
Improvemaintenance complexityVSAvoidcable occupancy
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The patent combines the cold plate body (for heat dissipation) with the flexible printed circuit (for signal transmission and power supply) into an integrated cold plate assembly. This merging eliminates the need for separate cables, reducing cable occupancy and simplifying maintenance while achieving heat dissipation, signal transmission, and power supply functions simultaneously

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cold plate assembly is designed to perform multiple functions: the cold plate body provides heat dissipation through cooling liquid flow channels, while the integrated flexible printed circuit provides signal transmission and power supply. This multi-functional design reduces the number of separate components and cables needed in the electronic device

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Volume of moving object

If cables are used for connecting modules or boards, then signal transmission and power supply are implemented, but the size of the electronic device increases

Engineering Contradiction:
Improveelectronic device sizeVSAvoidintegration level
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

By merging the cold plate body and flexible printed circuit into a single integrated assembly, the patent reduces the overall volume required for cable connections. The integrated design eliminates redundant space occupied by separate cables and their connectors, thereby reducing the electronic device size while improving integration

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If separate cables are used for heat dissipation, signal transmission, and power supply, then each function is independently achieved, but the overall system complexity and space consumption increase

Engineering Contradiction:
Improvesystem integrationVSAvoidspace consumption
Core Design Contradiction:
Device complexityVSArea of stationary object

Solution Approach 1:

The cold plate assembly is designed as a multi-functional component where the cold plate body handles heat dissipation and the integrated flexible printed circuit handles signal transmission and power supply. This universal design allows a single assembly to replace multiple separate systems, reducing space consumption and simplifying the overall system

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution reduces cable usage, simplifies maintenance, and improves space efficiency by integrating heat dissipation, signal transmission, and power supply into a single compact structure, enhancing the integration and performance of electronic devices.

Implementation Method 1

the cooling liquid is used to conduct heat of the electronic component through the cold plate body, to dissipate the heat for the electronic component

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20250301564A1Cold plate assembly, electronic device, and liquid cooling system
Publication Date: 2025.09.25 HUAWEI TECH CO LTD
  • US20250301564A1 patent drawing
  • US20250301564A1 patent drawing
  • US20250301564A1 patent drawing

AI summary

A cold plate assembly includes a cold plate body and a flexible printed circuit. The cold plate body is provided with a cooling liquid flow channel for flowing of cooling liquid. The cold plate body is connected to an electronic component in a thermally conductive manner, and the cooling liquid is used to conduct heat of the electronic component through the cold plate body, to dissipate the heat for the electronic component. The flexible printed circuit is integrated on the cold plate body, and the flexible printed circuit is provided with a high-speed signal cable and a power interconnection cable, where the high-speed signal cable and the power interconnection cable are separately used to electrically connect to the electronic component.