Integrated Common Mode Choke for Signal Integrity

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Solution Overview

Problem

High-speed data transmission systems, such as USB applications, face challenges in maintaining the amplitude and phase of differential signals while filtering out spurious common-mode signals introduced by transmission line effects, which are not effectively addressed by existing technologies.

Innovation Solution

The integration of an integrated common mode choke with transient voltage suppression devices, such as bidirectional transient voltage suppression diodes and capacitors, in semiconductor components to maintain signal integrity and filter out common-mode noise.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If differential signals are used for high-speed data transmission, then noise immunity is improved, but spurious common-mode signals are introduced by transmission line effects

Engineering Contradiction:

Improvenoise immunityVSAvoidspurious common-mode signals

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies common-mode chokes that convert the harmful common-mode signals into beneficial filtering action. The chokes are designed to present high impedance to common-mode signals while maintaining low impedance for differential signals, thus converting the harmful effect into a filtering mechanism that protects the transmission.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces common-mode chokes as intermediary elements between the differential signal transmission lines and the load/source. These chokes act as mediators that block common-mode noise from propagating while allowing differential signals to pass through unaffected.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If common mode chokes are added to filter spurious signals, then signal integrity is improved, but device complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoidcomponent count

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into integrated common-mode choke structures that combine filtering capability with compact packaging. The chokes are designed to handle multiple signal pairs simultaneously, reducing the overall component count while maintaining signal integrity across differential pairs.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The common-mode chokes are designed with universal applicability to handle multiple differential signal pairs using the same filtering mechanism. This multi-functional design allows a single choke structure to protect several transmission lines, reducing overall system complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively maintains the amplitude and phase of differential signals while filtering out spurious common-mode signals, enhancing noise immunity and cost efficiency in high-speed data transmission systems.

Implementation Method 1

a first coil and a second coil of a common mode choke formed in a semiconductor substrate

Methodology Applied

Scientific EffectElectromagnetic Induction: Electromagnetic Induction

Implementation Method 2

bidirectional transient voltage suppression diodes

Methodology Applied

Scientific EffectAvalanche Breakdown: Avalanche Breakdown

Implementation Method 3

capacitors

Methodology Applied

Scientific EffectCapacitance: Capacitance

Data Source

PatentUS8999807B2Method for manufacturing a semiconductor component that includes a common mode choke and structure

Publication Date: 2015.04.07 SEMICON COMPONENTS IND LLC

AI summary

A semiconductor component and methods for manufacturing the semiconductor component that includes a monolithically integrated common mode choke. In accordance with embodiments, a transient voltage suppression device may be coupled to the monolithically integrated common mode choke.