Integrated Connector Frame Structure for Solder-Free Electronic Assembly

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Solution Overview

Problem

Standardized operational connections for electronic devices, such as SATA, PCI, and PCIe, are typically manufactured separately and require soldering, leading to increased fabrication costs and potential signal noise.

Innovation Solution

Integrating the geometrical interface of standardized operational connectors into a frame that supports an electronic device member, allowing the enclosure to include rigid materials and a cavity with openings, where the physical connection points and keying features are configured as separate parts, with the connectors being part of the electronic device member or enclosure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If standardized operational connections are manufactured separately and soldered to electronic devices, then connection reliability is improved, but fabrication cost increases and signal noise is generated

Engineering Contradiction:

Improveconnection reliabilityVSAvoidfabrication cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the connector components directly into the enclosure structure. The enclosure includes integrated connector housings and contact points that are formed as part of the enclosure itself, eliminating the need for separate connector manufacturing and soldering operations. This integration reduces fabrication costs while maintaining connection reliability through precise molded features and direct mechanical engagement.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If standardized operational connections are manufactured separately and soldered to electronic devices, then connection reliability is improved, but signal noise increases

Engineering Contradiction:

Improveconnection reliabilityVSAvoidsignal noise

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent replaces the soldering process with a mechanical integration system. Connectors are formed as integral parts of the enclosure through molding and mechanical assembly, eliminating the thermal and chemical processes of soldering that generate signal noise. Electrical contacts are directly connected through conductive pathways integrated into the enclosure structure, reducing electromagnetic interference and signal degradation associated with solder joints.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of manufacture

If connectors are integrated into the electronic device member or enclosure, then fabrication cost is reduced and assembly is simplified, but connector security must be maintained

Engineering Contradiction:

Improvefabrication costVSAvoidconnector security

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent segments the connector into distinct functional elements within the enclosure: connector housings formed as integral portions of the enclosure, separate contact points, and modular mounting structures. This segmentation allows each element to be optimized for its specific function while maintaining overall connector security through precise geometric interlocking and dedicated retention features distributed throughout the integrated structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent implements nested connector structures where connector housings are formed within enclosure cavities, contact points are nested within housing recesses, and retention features are integrated within the contact structures. This nested arrangement maintains connector security through multiple levels of mechanical engagement while keeping the overall assembly compact and integrated into the enclosure.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentEP3526857B1Electronic device structures and methods of making

Publication Date: 2024.08.28 MICRON TECHNOLOGY INC

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AI summary

Electronic device structures may include a sleeve member including a cavity extending from a first end toward a second, opposite end, and an opening in communication with the cavity at the first end of the sleeve member. A frame configured to engage an electronic device member, such as a substrate bearing electronic components, may be sized and shaped to be positioned at least partially in the cavity. The frame may include a connector interface at a first end of the frame, the connector interface sized and shaped to at least partially occlude the opening and to accommodate a portion of the substrate extending therethrough and comprising a blade bearing electrical contacts. Support members may extend from proximate the connector interface toward the second end of the body within the cavity when the frame is located at least partially in the cavity.