Integrated Cooling Apparatus with Adjacent Pump

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Solution Overview

Problem

Conventional cooling apparatuses are bulky due to the connection of heat sinks, radiators, and electric pumps through pipes, leading to excessive size and complexity.

Innovation Solution

A compact cooling apparatus design featuring a cold plate with a coolant passage, a radiator with fins for air-cooled coolant flow, and a pump integrated adjacent to the radiator, eliminating the need for connecting pipes and optimizing the arrangement for efficient heat transfer and reduced size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the heat sink, radiator, and electric pump are connected through pipes, then the cooling apparatus can function properly, but the size of the cooling apparatus becomes excessive

Engineering Contradiction:
Improvecooling functionVSAvoidsize of cooling apparatus
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The patent integrates the heat sink and radiator into a single unified structure where the radiator is directly formed on the heat sink body. The heat sink includes a coolant passage and a radiator with fins that are integrally connected, eliminating the need for separate pipes to connect these components. This merging reduces the overall volume and simplifies the structure while maintaining the cooling function.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If the heat sink, radiator, and electric pump are connected through pipes, then the cooling apparatus can function properly, but the structural complexity increases

Engineering Contradiction:
Improvecooling functionVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The heat sink and radiator are merged into a single integrated component, reducing the number of separate parts and connections needed. The radiator fins are directly formed on the heat sink body, and the coolant passage is integrated within the heat sink structure, eliminating the need for external piping systems.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If the pump is located away from the radiator, then the cooling apparatus can function properly, but the size and complexity of the apparatus increases

Engineering Contradiction:
Improvecoolant circulationVSAvoidsize of cooling apparatus
Core Design Contradiction:
ReliabilityVSVolume of stationary object

Solution Approach 1:

The pump is integrated with the heat sink structure, with the pump body formed as an integral part of the heat sink. The pump is positioned adjacent to the radiator fins, and the coolant passage connects the pump directly to the radiator without requiring external pipes. This integration reduces the overall apparatus size and simplifies the structure.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The integrated design enhances cooling performance, reduces power consumption, and simplifies attachment to heat-radiating components, achieving a more efficient and compact cooling solution.

Implementation Method 1

The radiator includes fins used to perform cooling, and a second coolant passage in which the coolant flows

Methodology Applied
Scientific EffectHeat transfer: Convection

Implementation Method 2

the liquid passage is typically air-cooled to cool the coolant

Methodology Applied
Scientific EffectAir cooling: Forced Convection

Implementation Method 3

The pump is connected to each of the first coolant passage and the second coolant passage to circulate the coolant

Methodology Applied
Scientific EffectPumping: Pump

Implementation Method 4

The cold plate includes a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11236738B2Cooling apparatus
Publication Date: 2022.02.01 NIDEC CORP(JP)
  • US11236738B2 patent drawing
  • US11236738B2 patent drawing
  • US11236738B2 patent drawing

AI summary

A cooling apparatus includes a cold plate including a lower surface to be in contact with a heat-radiating component, and a first coolant passage in which a coolant flows, a radiator including fins to perform cooling, and a second coolant passage in which the coolant flows, and a pump connected to each of the first coolant passage and the second coolant passage to circulate the coolant. The radiator is provided on the cold plate. The pump is adjacent to the radiator.