Integrated Cooling Member for Solid-State Light Sources
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Solution Overview
Problem
Existing light source cooling systems for projectors require a large number of cooling jackets and hoses, leading to increased device size and weight, as well as reduced cooling performance due to increased pressure on the circulating fluid and decreased flow rate.
Innovation Solution
Cooling multiple solid-state light sources on the respective surfaces of a single cooling member, reducing the number of pipes and hoses needed for fluid circulation and simplifying the cooling configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple light sources are cooled by separate cooling jackets and hoses, then each light source can be cooled independently, but the number of hoses and joints increases, leading to increased device size and reduced cooling performance
Solution Approach 1:
The patent combines multiple cooling jackets into a single integrated cooling member that can cool multiple light sources simultaneously. The cooling member includes a single coolant flow channel that serves multiple light sources, reducing the number of hoses and joints while maintaining effective cooling of each light source.
Solution Approach 2:
The cooling member is designed to perform multiple cooling functions through a single structure. It can cool different light sources (semiconductor lasers and other light sources) using a unified cooling system, making the cooling system universal and reducing overall complexity.
2Volume of moving object
If the number of cooling jackets and hoses is reduced, then device size is reduced, but it becomes difficult to maintain independent cooling control for each light source
Solution Approach 1:
The cooling member is segmented into multiple cooling regions or zones, each corresponding to a specific light source. The single coolant flow channel is divided into multiple flow path sections that can independently cool different light sources, allowing independent temperature control while using a unified cooling structure.
Solution Approach 2:
The patent transitions from a one-to-one cooling jacket arrangement to a many-to-one arrangement where multiple light sources are cooled by a single cooling member. This dimensional change in the cooling system architecture reduces device size while maintaining cooling effectiveness through optimized coolant flow distribution.
3Reliability
If more hoses and joints are used to cool multiple light sources, then each light source can be cooled effectively, but the pressure on circulating fluid increases and flow rate decreases
Solution Approach 1:
By merging multiple cooling systems into a single integrated cooling member with one coolant flow channel, the patent eliminates multiple hoses and joints that caused pressure losses. This reduces fluid resistance and maintains higher flow rates while still achieving effective cooling of all light sources through the unified cooling structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the size of the cooling member, simplifies the cooling configuration, and maintains efficient cooling performance by minimizing the number of joints and hoses, thereby improving the overall efficiency and compactness of the projector.
Implementation Method 1
the heat generated by each light source is thermally conducted to coolant that flows through a coolant flow channel via the heat conduction unit
Implementation Method 2
circulating liquid coolant in a cooling jacket
Data Source
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AI summary
A light source device (31-33, 110, 120, 130, 150, 160) including a plurality of solid-state light sources (120, 130, 150), and a cooling member (31-33, 110, 160) having a plurality of cooling surfaces (110, 160), the cooling member (31-33, 110, 160) being configured to cool the plurality of solid-state light sources (120, 130, 150) provided on the respective cooling surfaces (110, 160).