Integrated Heat Transfer Cooling Module with Thermally Conductive Tower
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Solution Overview
Problem
Current heat transfer cooling modules for electronics are complex, costly, and inefficient in dissipating heat quickly, requiring improved manufacturing ease, cost-effectiveness, and thermal conductivity.
Innovation Solution
A modular heat transfer cooling system comprising a polymeric cover, thermally conductive tower, bracket, and radiators with optimized designs for easy assembly and efficient heat dissipation, utilizing materials like polymeric materials and radiators with fins for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat transfer cooling modules are used, then heat dissipation function is provided, but device complexity increases and manufacturing cost increases
Solution Approach 1:
The patent combines the heat sink and radiator into a single integrated cooling module, where the heat sink directly contacts the electronic component and the radiator extends outward for heat dissipation. This integration eliminates the need for separate heat transfer components and complex assembly, reducing device complexity while maintaining effective heat dissipation function.
2Reliability
If traditional heat transfer cooling modules are used, then heat dissipation function is provided, but manufacturing cost increases
Solution Approach 1:
By integrating the heat sink and radiator into one molded component, the patent reduces the number of parts that need to be manufactured, stored, and assembled. This single-component approach simplifies the supply chain and manufacturing processes, lowering overall production costs while maintaining the required heat dissipation performance.
Solution Approach 2:
The patent utilizes the molding process to directly create the complex three-dimensional geometry of the cooling module, including internal channels and external radiator fins. By changing the manufacturing parameter from mechanical machining to mold-based fabrication, the patent achieves cost-effectiveness for complex geometries that would be expensive to machine traditionally.
3Productivity
If complex cooling modules are used, then heat dissipation efficiency is improved, but ease of manufacture decreases
Solution Approach 1:
The patent transitions from mechanical manufacturing methods to injection molding or similar mold-based fabrication processes. This parameter change enables the efficient production of complex three-dimensional cooling geometries with internal fluid channels and external radiator structures, achieving high heat dissipation efficiency while maintaining ease of manufacture through standardized molding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively and efficiently transfers heat away from electronics, dissipating it quickly and cost-effectively, while being easy to manufacture and assemble, optimizing space usage.
Implementation Method 1
thermally conductive tower
Implementation Method 2
radiators with fins for enhanced thermal conductivity
Implementation Method 3
radiators with fins for enhanced thermal conductivity
Data Source
AI summary
A heat transfer cooling module is described. One embodiment of the module has a plate attached to a bracket. A tower is affixed the plate. One end of the tower can be in contact with the heat source. The opposite end of the tower has a radiator attached which dissipates the heat that travels from the first end of the tower to the opposite end of the tower. Both the tower and the radiator are made from efficient materials for the transfer of heat. Another embodiment of the heat transfer cooling module is shown where the device is in two pieces, the first a fin module affixed to a bracket. The heat source is in contact with a base of the fin module where the heat travels through the base, to the fins where it dissipates to ambient.