Integrated Liquid Cooling Pump with Radiator Fins
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Solution Overview
Problem
Existing liquid cooling systems for electronic devices require significant space and have poor flexibility in installation due to external connections of components, leading to inefficient cooling and reduced pump lifespan from high temperature exposure.
Innovation Solution
An integrated liquid cooling system with a pump body positioned between cooling tubes, featuring a fan for heat dissipation that also cools the pump, and a partitioned liquid chamber for efficient coolant circulation, reducing space requirements and enhancing heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the pump is arranged on top of the heat absorbing device, then the components can be integrated, but the pump is easily affected by high temperature and its lifespan is reduced
Solution Approach 1:
The patent combines the pump body and heat dissipating device into a single integrated component, where the pump body is positioned between the cooling tubes and the heat dissipating fins are arranged on the outer surface of the pump body. This merging eliminates the need for separate mounting brackets and connecting pipes, reducing assembly complexity while maintaining reliability through effective heat dissipation.
Solution Approach 2:
The patent converts the harmful high temperature environment into a beneficial heat dissipation opportunity by arranging heat dissipating fins directly on the pump body. The pump's own heat generation and the heat from the cooling system are both utilized to drive heat through the fins, turning the temperature issue into an efficient heat exchange mechanism that protects the pump rather than damages it.
2Ease of manufacture
If three components are connected through external pipes, then each component can be independently designed, but a relatively large space is utilized and installation is inconvenient
Solution Approach 1:
The patent merges the pump body, cooling tubes, and heat dissipating device into a single integrated assembly. The cooling tubes are positioned within the pump body structure, and heat dissipating fins are attached to the outer surface, eliminating the need for external connecting pipes and mounting brackets. This reduces the overall system volume while maintaining the functional independence of each component through modular internal design.
3Ease of operation
If the pump body is externally connected to cooling tubes, then assembly is straightforward, but assembly efficiency is low and manufacturing cost is high
Solution Approach 1:
The patent integrates the cooling tubes directly into the pump body structure, with tubes positioned within the pump chamber and connected to the heat dissipating device. This eliminates multiple external connection steps and reduces the number of separate parts that need to be assembled, thereby improving assembly efficiency and reducing manufacturing costs while maintaining ease of operation through a streamlined single-piece design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves improved heat dissipation, prolongs pump lifespan, reduces noise, and simplifies assembly while minimizing space and cost, resulting in a more efficient and durable cooling solution.
Implementation Method 1
a pumping device, integrally mounted between the cooling tubes to generate power for circulation of coolant inside the cooling tubes
Implementation Method 2
a heat absorbing device attaching to a heat-generating component and arranged for heat conduction with the heat-generating component
Implementation Method 3
a heat dissipating device, which comprises cooling tubes and a radiator structure arrangement on the cooling tubes
Implementation Method 4
a heat dissipating device, which comprises cooling tubes and a radiator structure arrangement on the cooling tubes
Data Source
AI summary
Disclosed is a liquid cooling radiation system. The technical solution used by the present invention to solve the technical problem is: the liquid cooling radiation system comprises: a radiation device, comprising cooling pipes and a radiation structure device arranged on the cooling pipes; a pumping device, integrally arranged between the cooling pipes and generating power so that a coolant circulates within the cooling pipes; a heat absorption device, attached to a heating device and having a heat conduction effect with the heating device; a pipeline, used for connecting the radiation device and the heat absorption device. On the basis of existing products, the present invention utilises a solution wherein a liquid pump main body and a radiator are integrally arranged together. Thus, the radiation of a fan is used to take away heat on the radiator and heat generated by a pump power main body (i.e. a motor) itself is also taken away, thereby extending the service life of the motor. In addition, the occupied space is significantly reduced, the heat transfer effect is significantly improved, and the production and assembly costs are reduced, so that product assembly is convenient and efficiency is high.